Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 7/20 | 0.55 |
| ▸ | HPGD | P15428 | 1/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.50 |
| ▸ | TP53 | P04637 | 3/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | THRB | P10828 | 4/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.46 |
| ▸ | HCAR2 | Q8TDS4 | 2/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | P2RY10 | O00398 | 3/20 | 0.32 |
| ▸ | GPR34 | Q9UPC5 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1068090 | 0.91 | TSHR (0.59) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL3275277 | 0.90 | TSHR (0.50) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL28886835 | 0.88 | TSHR (0.56) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL11663725 | 0.88 | TSHR (0.56) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL21612165 | 0.87 | TSHR (0.57) | TSHRHPGDALDH1A1TP53HIF1A | |
| Diethyl Hydrogen Phosphate SCHEMBL27771341 | 0.86 | TSHR (0.55) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL7551992 | 0.86 | TSHR (0.70) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL7551686 | 0.86 | TSHR (0.70) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL24359828 | 0.84 | TSHR (0.62) | TSHRHPGDALDH1A1TP53HIF1A | |
| SCHEMBL3273860 | 0.84 | TSHR (0.52) | TSHRHPGDALDH1A1TP53HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 334 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4554993-A1 | ADHESIVE COMPOSITION | DDP Specialty Electronic Materials US, LLC (US) | 2025-05-21 | — | — | EP | claimed |
| WO-2024015165-A1 | ADHESIVE COMPOSITION | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) | 2024-01-18 | — | — | WO | claimed |
| EP-3371232-B1 | TWO-PARTS ADHESIVE SYSTEM | LORD CORP (US) | 2021-01-06 | — | — | EP | claimed |
| US-8530017-B2 | Method for preparing styrene-butadiene copolymer using reactive emulsifier and styrene-butadiene copolymer prepared by the same | KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) | 2013-09-10 | — | — | US | claimed |
| US-20120164363-A1 | Method for Preparing Styrene-Butadiene Copolymer Using Reactive Emulsifier and Styrene-Butadiene Copolymer Prepared By the Same | KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) | 2012-06-28 | — | — | US | claimed |
| US-20040229990-A1 | Acrylic structural adhesive having improved T-peel strength | LORD CORPORATION | 2004-11-18 | — | — | US | claimed |
| US-20250368867-A1 | ADHESIVE COMPOSITION | DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) | 2025-12-04 | — | — | US | disclosed |
| EP-4554993-A1 | ADHESIVE COMPOSITION | DDP Specialty Electronic Materials US, LLC (US) | 2025-05-21 | — | — | EP | disclosed |
| EP-4554991-A1 | ADHESIVE COMPOSITION | DDP Specialty Electronic Materials US, LLC (US) | 2025-05-21 | — | — | EP | disclosed |
| WO-2025058788-A1 | ADHESIVE COMPOSITION | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) | 2025-03-20 | — | — | WO | disclosed |
| CN-119546662-A | Adhesive composition | DDP特种电子材料美国有限责任公司 | 2025-02-28 | — | — | CN | disclosed |
| CN-110998935-B | Binder composition for electrochemical element, slurry composition for electrochemical element, functional layer for electrochemical element, and electrochemical element | 日本瑞翁株式会社 | 2024-07-09 | — | — | CN | disclosed |
| CN-118251782-A | Composition for electrochemical element, method for producing same, binder composition for electrochemical element, conductive material dispersion for electrochemical element, slurry for electrochemical element electrode, electrode for electrochemical element, and electrochemical element | 日本瑞翁株式会社 | 2024-06-25 | — | — | CN | disclosed |
| US-7019075-B2 | Acrylic structural adhesive having improved T-peel strength | LORD CORPORATION (US) | 2006-03-28 | — | — | US | disclosed |
| EP-1504070-A1 | ACRYLIC STRUCTURAL ADHESIVE HAVING IMPROVED T-PEEL STRENGTH | Lord Corporation (US) | 2005-02-09 | — | — | EP | disclosed |
| US-20040229990-A1 | Acrylic structural adhesive having improved T-peel strength | LORD CORPORATION | 2004-11-18 | — | — | US | disclosed |
| US-20040059058-A1 | Acrylic structural adhesive having improved T-peel strength | LORD CORPORATION | 2004-03-25 | — | — | US | disclosed |
| US-6660805-B1 | Two-part adhesive: part A-monomer, toughener(s), optional adhesion promotor and reducing agent; part B-epoxy resin | LORD CORPORATION | 2003-12-09 | — | — | US | disclosed |
| WO-2003097756-A1 | ACRYLIC STRUCTURAL ADHESIVE HAVING IMPROVED T-PEEL STRENGTH | LORD CORPORATION (US) | 2003-11-27 | — | — | WO | disclosed |
| US-20030216513-A1 | TWO-PART ADHESIVE: PART A-MONOMER,TOUGHENER(S), OPTIONAL ADHESION PROMOTOR AND REDUCING AGENT; PART B-EPOXY RESIN | LORD CORPORATION | 2003-11-20 | — | — | US | disclosed |