SCHEMBL3416616

SCHEMBL3416616

OCC1(C(OC(C2(CO)COC2)C2(CO)COC2)C2(CO)COC2)COC1

nearest known ligand 0.39

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16572230 0.72
SCHEMBL4186713 0.72
SCHEMBL8841196 0.68
SCHEMBL4198627 0.67 EPHX1 (0.41) EPHX1
SCHEMBL20355888 0.65 EPHX1 (0.34) EPHX1
SCHEMBL9619362 0.63 EPHX1 (0.37) EPHX1
SCHEMBL216525 0.63 EPHX1 (0.32) EPHX1
SCHEMBL9809612 0.63 EPHX1 (0.32) EPHX1
SCHEMBL13094616 0.61 EPHX1 (0.34) EPHX1
SCHEMBL504534 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10059803-B2 Resin containing oxetane and epoxy groups and resin composition including the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2018-08-28 US disclosed
US-9365717-B2 Carboxyl group-containing polyimide, thermosetting resin composition and flexible metal-clad laminate TOYOBO CO., LTD. (JP) 2016-06-14 US disclosed
US-20160145387-A1 RESIN CONTAINING OXETANE AND EPOXY GROUPS AND RESIN COMPOSITION INCLUDING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2016-05-26 US disclosed
EP-2716674-B1 CARBOXYL GROUP-CONTAINING POLYIMIDE, HEAT-CURABLE RESIN COMPOSITION, AND FLEXIBLE METAL-CLAD LAMINATE TOYO BOSEKI (JP) 2016-04-27 EP disclosed
US-20130310486-A1 CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE TOYOBO CO., LTD. (JP) 2013-11-21 US disclosed
US-20100069599-A1 OXETANE-CONTAINING RESIN, AS WELL AS AN ADHESIVE AND A RESIST AGENT USING THE SAME TOYO BOSEKI KABUSHIKI KAISHA (JP) 2010-03-18 US disclosed
EP-2090610-A1 OXETANE-CONTAINING RESIN, AND ADHESIVE AGENT AND RESIST AGENT EACH USING THE SAME Toyo Boseki Kabushiki Kasisha (JP) 2009-08-19 EP disclosed