SCHEMBL342872

SCHEMBL342872

CC(C)[O-].CC(C)[O-].CCC(C(C)=O)C(=O)[O-].[Al+3]

nearest known ligand 0.36

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.34
TSHR P16473 2/20 0.34
NFKB1 P19838 2/20 0.34
NPSR1 Q6W5P4 2/20 0.34
CA1 P00915 4/20 0.34
CA2 P00918 2/20 0.33
GAA P10253 1/20 0.33
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1230379 1.00 CYP3A4 (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL2156822 0.95 TSHR (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL1230516 0.95 CYP3A4 (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL407252 0.95 TSHR (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL1229335 0.95 CYP3A4 (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL1132735 0.95 TSHR (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL10982849 0.95 CYP3A4 (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL1230462 0.95 CYP3A4 (0.34) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL733389 0.93 CA1 (0.33) CYP3A4TSHRNFKB1NPSR1CA1
SCHEMBL532505 0.93 CA1 (0.33) CYP3A4TSHRNFKB1NPSR1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1197 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11400433-B2 Composite granules including metal-containing polymeric materials 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-08-02 US claimed
CN-109642081-B Method for producing lignin-containing resin composition and lignin-containing resin molded article 出光兴产株式会社 2022-04-26 CN claimed
CN-111607323-A Easy-to-clean anti-graffiti nano coating for automobile paint surface and construction process 广州希森美克新材料科技股份有限公司 2020-09-01 CN claimed
US-20200188875-A1 COMPOSITE GRANULES INCLUDING METAL-CONTAINING POLYMERIC MATERIALS 3M INNOVATIVE PROPERTIES COMPANY 2020-06-18 US claimed
EP-3538260-A1 COMPOSITE GRANULES INCLUDING METAL-CONTAINING POLYMERIC MATERIALS 3M Innovative Properties Company (US) 2019-09-18 EP claimed
WO-2018089870-A1 COMPOSITE GRANULES INCLUDING METAL-CONTAINING POLYMERIC MATERIALS 3M INNOVATIVE PROPERTIES COMPANY (US) 2018-05-17 WO claimed
US-9640396-B2 Spin-on spacer materials for double- and triple-patterning lithography BREWER SCIENCE INC. (US) 2017-05-02 US claimed
EP-3040394-A1 COMPOSITIONS AND METHODS FOR WATER CONTROL AND STRENGTHENING UNCONSOLIDATED FORMATIONS Halliburton Energy Services, Inc. (US) 2016-07-06 EP claimed
EP-1786882-B1 METHODS FOR WATER CONTROL AND STRENGTHENING UNCONSOLIDATED FORMATIONS HALLIBURTON ENERGY SERVICES INC (US) 2016-04-13 EP claimed
US-8999589-B2 Nonaqueous secondary battery SANYO ELECTRIC CO., LTD. (JP) 2015-04-07 US claimed
WO-2002070104-A1 PURIFICATION MATERIALS AND METHOD OF FILTERING USING THE SAME WATERVISIONS INTERNATIONAL, INC. (US) 2002-09-12 WO claimed
US-20010040785-A1 Thin film deposition of mixed metal oxides HILCO PATENT ACQUISITION 56, LLC 2001-11-15 US claimed
US-6312565-B1 Thin film deposition of mixed metal oxides AGERE SYSTEMS GUARDIAN CORP. 2001-11-06 US claimed
US-5292364-A Containing organometallic compound, organic polymer and below a specified moisture content; bonding substrates TOAGOSEI CHEMICA INDUSTRY CO., LTD. (JP) 1994-03-08 US claimed
US-5110392-A PRIMER COMPOSITION CONTAINING AN ORGANOMETALLIC COMPOUND FOR BINDING SUBSTRATES WITH A CYANOCRYLATE ADHESIVE TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1992-05-05 US claimed
EP-0129069-B1 PROCESS FOR BONDING NON-POLAR OR HIGHLY CRYSTALLINE RESIN SUBSTRATS TO EACH OTHER OR TO ANOTHER MATERIAL TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-21 EP claimed
EP-0420293-A1 Primer TOAGOSEI CO., LTD. (JP) 1991-04-03 EP claimed
US-4818325-A BLEND WITH ORGANOMETALLIC COMPOUND AND ORGANIC POLYMERS TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1989-04-04 US claimed
EP-0129069-A2 Process for bonding non-polar or highly crystalline resin substrats to each other or to another material TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1984-12-27 EP claimed
US-4040083-A ALUMINUM OXIDE LAYER BONDING POLYMER RESIN LAYER TO SEMICONDUCTOR DEVICE HITACHI, LTD. (JA) 1977-08-02 US claimed