SCHEMBL345429

SCHEMBL345429

CO[SiH](OC)C(C)CCCN=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL391412 0.95
SCHEMBL391208 0.93
SCHEMBL393994 0.89
SCHEMBL16239317 0.84
SCHEMBL345173 0.82
SCHEMBL395747 0.79
SCHEMBL395739 0.77
SCHEMBL19125245 0.77
SCHEMBL390364 0.76
SCHEMBL393430 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8378037-B2 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2013-02-19 US claimed
EP-2231740-B1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2011-08-24 EP claimed
EP-2231740-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME Momentive Performance Materials Inc. (US) 2010-09-29 EP claimed
WO-2009085285-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2009-07-09 WO claimed
US-20090171040-A1 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. 2009-07-02 US claimed
EP-4579937-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR BATTERY INSULATION MEMBER, AND BATTERY INSULATION MEMBER Toray Industries, Inc. (JP) 2025-07-02 EP disclosed
WO-2025023145-A1 ARTICLE INCLUDING SUBSTRATE SURFACE-TREATED WITH ORGANOSILICON COMPOUND, PREPREG, PRINTED WIRING BOARD, AND GLASS CLOTH TREATMENT LIQUID 信越化学工業株式会社 2025-01-30 WO disclosed
WO-2025023144-A1 ORGANOSILICON COMPOUND, ARTICLE INCLUDING SUBSTRATE SURFACE-TREATED WITH ORGANOSILICON COMPOUND, PREPREG, PRINTED WIRING BOARD, AND GLASS CLOTH TREATMENT LIQUID 信越化学工業株式会社 2025-01-30 WO disclosed
WO-2024150567-A1 POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, AND PRODUCTION METHODS THEREFOR DIC株式会社 2024-07-18 WO disclosed
WO-2024116565-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE STRUCTURE, AND METHODS FOR PRODUCING THESE DIC株式会社 2024-06-06 WO disclosed
WO-2024116567-A1 METHODS FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, AND COMPOSITE STRUCTURE DIC株式会社 2024-06-06 WO disclosed
WO-2024116563-A1 METHOD FOR PRODUCING POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE DIC株式会社 2024-06-06 WO disclosed
EP-1033388-A1 THERMOPLASTIC RESIN COMPOSITION KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2000-09-06 EP disclosed
EP-1022314-A1 POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME TORAY INDUSTRIES, INC. (JP) 2000-07-26 EP disclosed
EP-0957132-A1 Polyamide resin composition TORAY INDUSTRIES, INC. (JP) 1999-11-17 EP disclosed
EP-0888880-A1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1999-01-07 EP disclosed
EP-0852249-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1998-07-08 EP disclosed
US-4366184-A PLASMA/GASES/, ORGANOSILICON COMPOUND LORD CORPORATION (US) 1982-12-28 US disclosed
US-4308071-A ISOCYANATO-FUNCTIONAL ORGANO SILANE STORAGE STABLE RUBBER TO METAL ADHESIVE LORD CORPORATION (US) 1981-12-29 US disclosed
US-4031120-A Isocyanatosilane adducts LORD CORPORATION (US) 1977-06-21 US disclosed