SCHEMBL345543

SCHEMBL345543

O=S(O)c1ccccc1Cl

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.43
LMNA P02545 1/20 0.43
CES2 O00748 1/20 0.41
CES1 P23141 1/20 0.41
G6PD P11413 1/20 0.41
KMT2A Q03164 2/20 0.41
ALDH1A1 P00352 3/20 0.40
POLB P06746 1/20 0.37
CYP11B1 P15538 1/20 0.33
CYP11B2 P19099 1/20 0.33
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33
RXFP1 Q9HBX9 1/20 0.32
CYP1A2 P05177 1/20 0.32
HPGD P15428 1/20 0.32
CYP2C19 P33261 1/20 0.32
HTR3E A5X5Y0 1/20 0.32
HTR3B O95264 1/20 0.32
HTR3A P46098 1/20 0.32
HTR3D Q70Z44 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1465308 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
Ammonia Solution, Strong SCHEMBL28189890 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL28190517 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL1465303 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL7513507 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL28189908 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL7518790 0.98 TSHR (0.41) TSHRLMNACES2CES1G6PD
Ethylamine SCHEMBL28190525 0.88 KMT2A (0.38) TSHRLMNACES2CES1G6PD
Tetrylammonium SCHEMBL28190527 0.84 CHRM2 (0.41) TSHRLMNACES2CES1G6PD
SCHEMBL28189894 0.83 TSHR (0.48) TSHRLMNAKMT2AALDH1A1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 302 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2110392-B1 DIVIDED REDOX-CURING-TYPE COMPOSITION KURARAY NORITAKE DENTAL INC (JP) 2020-05-06 EP claimed
CN-110571390-A Method for compositely modifying lithium-sulfur battery diaphragm by salinized graphene and carbon nano tube 华南师范大学 2019-12-13 CN claimed
US-20160222523-A1 SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL ATOTECH USA, LLC 2016-08-04 US claimed
US-20160168722-A1 SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL ATOTECH DEUTSCHLAND GMBH (DE) 2016-06-16 US claimed
CN-104628606-A Preparation method of sulfohydrazide compound WANG HUA 2015-05-20 CN claimed
US-8853297-B2 Method and means for infiltrating enamel lesions CHARITE UNIVERSITATSMEDIZIN BERLIN (DE) 2014-10-07 US claimed
US-8329845-B2 Divided redox-curing type composition KURARAY NORITAKE DENTAL INC. (JP) 2012-12-11 US claimed
CN-101379220-B Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material ATOTECH DEUTSCHLAND GMBH 2011-05-11 CN claimed
US-20100288731-A1 Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material ATOTECH DEUTSCHLAND GMBH (DE) 2010-11-18 US claimed
US-20090304622-A1 METHOD AND MEANS FOR INFILTRATING ENAMEL LESIONS CHARITE-UNIVERSITATSMEDIZIN BERLIN (DE) 2009-12-10 US claimed
US-6723385-B1 PRETREAT COPPER SURFACES SO THAT A TIGHT BOND CAN BE SUBSEQUENTLY FORMED BETWEEN THE PRETREATED COPPER SURFACES AND PLASTIC SUBSTRATES OF PRINTED CIRDUIT BOARDS ATOTECH DEUTSCHLAND GMBH (DE) 2004-04-20 US claimed
CN-1461584-A Improved adhesion of polymeric materials to metal surfaces ATOTECH DEUTSCHLAND GMBH (DE) 2003-12-10 CN claimed
EP-1310142-A2 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH Deutschland GmbH (DE) 2003-05-14 EP claimed
US-6562149-B1 For firmly bonding laminated multilayered printed circuit boards and for bonding resists to copper ATOTECH DEUTSCHLAND GMBH (DE) 2003-05-13 US claimed
WO-2002079542-A9 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2003-03-20 WO claimed
US-6506314-B1 Intergranular etching; immersing in plating solution con-taining hydrogen peroxide, sulfuric acid or a sulfonic acid, five membered nitrogen heterocyclic compound and such as triphenyl sulfonium chloride ATOTECH DEUTSCHLAND GMBH (DE) 2003-01-14 US claimed
WO-2002079542-A2 IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2002-10-10 WO claimed
US-5159082-A Catalytic coupling of an aromatic sulfinic acid with an aromatic halogen compound MITSUBISHI KASEI CORPORATION (JP) 1992-10-27 US claimed
EP-0405389-A1 Process for producing an aromatic compound Mitsubishi Chemical Corporation (JP) 1991-01-02 EP claimed
US-4613680-A ISOMERIZATION TORAY INDUSTRIES, INC. (JP) 1986-09-23 US claimed