⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL782261 | 0.56 | — | — | |
| SCHEMBL4647534 | 0.50 | — | — | |
| SCHEMBL8451582 | 0.49 | — | — | |
| SCHEMBL283742 | 0.45 | — | — | |
| SCHEMBL9613597 | 0.43 | GBA1 (0.47) | — | |
| SCHEMBL14191362 | 0.43 | GBA1 (0.47) | — | |
| SCHEMBL10076292 | 0.43 | GBA1 (0.47) | — | |
| SCHEMBL11915509 | 0.43 | GBA1 (0.47) | — | |
| SCHEMBL14191363 | 0.43 | GBA1 (0.47) | — | |
| SCHEMBL17178259 | 0.43 | GBA1 (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8986846-B2 | Thermosetting oligomer or polymer, thermosetting resin composition including the oligomer or polymer, and printed circuit board using the composition | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2015-03-24 | — | — | US | disclosed |
| US-20100155120-A1 | THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION | SAMSUNG ELECTRONICS CO. LTD. (KR) | 2010-06-24 | — | — | US | disclosed |