SCHEMBL346379

SCHEMBL346379

CC(C)(c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2)cc1)c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RXRB P28702 4/20 0.50
AKR1C2 P52895 1/20 0.50
AKR1C1 Q04828 1/20 0.50
MCL1 Q07820 4/20 0.47
TDP1 Q9NUW8 1/20 0.46
ACMSD Q8TDX5 3/20 0.46
HNF4A P41235 2/20 0.46
DHFR P00374 1/20 0.46
KDM4E B2RXH2 1/20 0.46
GFER P55789 1/20 0.46
KMT2A Q03164 1/20 0.46
RXFP1 Q9HBX9 1/20 0.46
RXRA P19793 3/20 0.45
CFD P00746 1/20 0.43
RXRG P48443 1/20 0.43
DCLRE1A Q6PJP8 1/20 0.41
DCLRE1B Q9H816 1/20 0.41
PPM1B O75688 1/20 0.41
ALDH1A1 P00352 1/20 0.41
XDH P47989 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29459135 1.00 RXRB (0.50) RXRBAKR1C2AKR1C1MCL1TDP1
SCHEMBL9789238 0.93 TDP1 (0.50) RXRBAKR1C2AKR1C1MCL1TDP1
Bisphenol A SCHEMBL20303192 0.91 ESR1 (0.53) RXRBAKR1C2AKR1C1MCL1TDP1
SCHEMBL29393207 0.86 TDP1 (0.54) RXRBAKR1C2AKR1C1TDP1KDM4E
SCHEMBL1098811 0.86 TDP1 (0.54) RXRBAKR1C2AKR1C1TDP1KDM4E
SCHEMBL31149852 0.84 KDM4E (0.70) RXRBAKR1C2AKR1C1MCL1TDP1
SCHEMBL8999914 0.84 RXRB (0.55) RXRBMCL1ACMSDHNF4ADHFR
SCHEMBL1348760 0.84 KDM4E (0.70) RXRBAKR1C2AKR1C1MCL1TDP1
SCHEMBL105948 0.84 TDP1 (0.56) RXRBAKR1C2AKR1C1TDP1KDM4E
SCHEMBL29361914 0.84 TDP1 (0.56) RXRBAKR1C2AKR1C1TDP1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 154 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12297354-B2 Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor MITSUI MINING & SMELTING CO., LTD. (JP) 2025-05-13 US disclosed
US-20240381529-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG RESONAC CORPORATION (JP) 2024-11-14 US disclosed
WO-2024204831-A1 COMPOSITION LIQUID FOR SURFACE TREATMENT, AND METHOD FOR PRODUCING SURFACE TREATMENT SUBSTANCE, METAL-COATED RESIN, RESIN LAMINATE, AND RESIN-COATED SUBSTANCE 豊光社テクノロジーズ株式会社 2024-10-03 WO disclosed
CN-115124716-B Polyimide, film composition and film formed therefrom 财团法人工业技术研究院 2024-04-02 CN disclosed
CN-111344351-B Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor 三井金属矿业株式会社 2024-02-09 CN disclosed
US-11890853-B2 Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor MITSUI MINING & SMELTING CO., LTD. (JP) 2024-02-06 US disclosed
CN-113039237-B Polyimide film, polyimide composition, and method for producing film using same 株式会社东进世美肯 2023-12-15 CN disclosed
US-20230331946-A1 METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-10-19 US disclosed
WO-2023149581-A1 SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE 豊光社テクノロジーズ株式会社 2023-08-10 WO disclosed
US-20230107922-A1 RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAPACITOR ELEMENT, AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR MITSUI MINING & SMELTING CO., LTD. (JP) 2023-04-06 US disclosed
US-20060072221-A1 Birefringence optical film NITTO DENKO CORPORATION (JP) 2006-04-06 US disclosed
US-20060055853-A1 Optical film and its manufacturing method NITTO DENKO CORPORATION (JP) 2006-03-16 US disclosed
US-20050231839-A1 Optical film NITTO DENKO CORPORATION (JP) 2005-10-20 US disclosed
US-20050221023-A1 Polyimide film and process for producing the same NITTO DENKO CORPORATION (JP) 2005-10-06 US disclosed
US-20050206810-A1 Polarization plate having optical compensation function and liquid crystal display device using the same NITTO DENKO CORPORATION (JP) 2005-09-22 US disclosed
US-20050151906-A1 Method for producing birefringent film NITTO DENKO CORPORATION (JP) 2005-07-14 US disclosed
US-20050099562-A1 Stacked phase shift sheet, stacked polarizing plate including the same and image display NITTO DENKO CORPORATION (JP) 2005-05-12 US disclosed
US-20050030456-A1 Optical film, laminated polarizing plate, liquid crystal display using the same, and self-light-emitting display using the same NITTO DENKO CORPORATION (JP) 2005-02-10 US disclosed
EP-1469328-A1 OPTICAL FILM, MULTILAYER POLARIZATION PLATE, LIQUID CRYSTAL DISPLAY COMPRISING THEM, AND SPONTANEOUS EMISSION DISPLAY NITTO DENKO CORPORATION (JP) 2004-10-20 EP disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed