SCHEMBL3464634

SCHEMBL3464634

C=CC(=O)OC(C)COc1ccc(C(C)(C)c2ccc(OCC(C)OC(=O)C=C)cc2)cc1

nearest known ligand 0.49

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
AR P10275 2/20 0.46
HTT P42858 4/20 0.45
HIF1A Q16665 1/20 0.45
KDM4E B2RXH2 9/20 0.43
ALDH1A1 P00352 7/20 0.43
SMN1; SMN2 Q16637 4/20 0.43
GAA P10253 3/20 0.42
TDP1 Q9NUW8 1/20 0.41
KMT2A Q03164 5/20 0.40
MEN1 O00255 4/20 0.40
POLB P06746 2/20 0.39
NPC1 O15118 1/20 0.37
RAB9A P51151 1/20 0.37
LMNA P02545 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14173111 1.00 AR (0.46) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL28040939 0.95 AR (0.43) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL19770673 0.95 AR (0.43) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL19770674 0.95 AR (0.43) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL14368604 0.93 AR (0.41) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL14173126 0.93 KDM4E (0.43) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL17858306 0.92 AR (0.41) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL19661700 0.91 AR (0.40) ARHTTHIF1AKDM4EALDH1A1
SCHEMBL9854345 0.90 TSHR (0.43) HTTSMN1; SMN2GAAPOLBLMNA
SCHEMBL28855307 0.89 KDM4E (0.44) ARHTTHIF1AKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 194 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115350335-A Bionic composite material for dental restoration and application thereof 爱迪特(秦皇岛)科技股份有限公司 2022-11-18 CN claimed
JP-4202309-A None JP disclosed
CN-111602229-B Support sheet and composite sheet for forming protective film 琳得科株式会社 2024-06-21 CN disclosed
CN-109789666-B Composite sheet for forming protective film 琳得科株式会社 2024-06-04 CN disclosed
CN-118027840-A Composite sheet for forming protective film 琳得科株式会社 2024-05-14 CN disclosed
CN-111587472-B Support sheet and composite sheet for forming protective film 琳得科株式会社 2024-04-30 CN disclosed
CN-111849377-B Composite sheet for forming protective film 琳得科株式会社 2024-03-08 CN disclosed
CN-111373509-B Support sheet and composite sheet for forming protective film 琳得科株式会社 2024-01-30 CN disclosed
CN-113396144-B Polymer compound and method for producing same, composition and method for producing same, resin composition, additive for lubricating oil, and lubricating oil 三菱化学株式会社 2024-01-12 CN disclosed
CN-111466014-B Composite sheet for forming protective film and method for producing same 琳得科株式会社 2024-01-02 CN disclosed
US-6238841-B1 RESIN OBTAINED BY INTRODUCING A STYRYLPYRIDINIUM, STYRYLQUINOLINIUM OR METHYLOLAMIDE GROUP INTO A POLYVINYL ALCOHOL POLYMER; PREPOLYMER HAVING CARBOXYL GROUP AND AT LEAST TWO ETHYLENICALLY UNSATURATED GROUPS IN MOLECULE; EPOXIDE GOO CHEMICAL CO., LTD. (JP) 2001-05-29 US disclosed
EP-1057808-A2 Sulfur-containing unsaturated carboxylate compound and its use Mitsui Chemicals, Inc. (JP) 2000-12-06 EP disclosed
US-6136507-A WATER-SOLUBLE PHOTOSENSITIVE RESIN OBTAINED BY INTRODUCING STYRYL PYRIDINIUM GROUP INTO A POLYVINYL ALCOHOL POLYMER, SECOND RESIN OBTAINED BY INTRODUCING STYRYL QUINOLINIUM GROUP, THIRD RESIN OBTAINED BY INTRODUCING ALKYLOL ACRYLAMIDE GOO CHEMICAL CO., LTD. (JP) 2000-10-24 US disclosed
EP-0942328-A1 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards Goo Chemical Co., Ltd. (JP) 1999-09-15 EP disclosed
US-5633328-A HEAT RESISTANT; PRESSURE SENSITIVE ADHESIVES NIPPON SHOKUBAI CO., LTD. (JP) 1997-05-27 US disclosed
JP-H04202309-A COMPOSITION FOR PLASTIC LENS MITSUBISHI RAYON CO LTD 1992-07-23 JP disclosed
EP-0105421-B1 PHOTOSENSITIVE STRIPPING MATERIAL AND PROCESS FOR OBTAINING A PHOTORESIST STENCIL HOECHST AKTIENGESELLSCHAFT (DE) 1988-06-08 EP disclosed
US-4559292-A PHOTORESIST STENCILS AND SOLDER MASKS HOECHST AKTIENGESELLSCHAFT (DE) 1985-12-17 US disclosed
US-4458007-A PRINTING PLATES, PHOTORESISTS HOECHST AKTIENGESELLSCHAFT (DE) 1984-07-03 US disclosed
EP-0105421-A1 Photosensitive stripping material and process for obtaining a photoresist stencil HOECHST AKTIENGESELLSCHAFT (DE) 1984-04-18 EP disclosed