Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | F13A1 | P00488 | 3/20 | 0.33 |
| ▸ | TTR | P02766 | 4/20 | 0.31 |
| ▸ | MEN1 | O00255 | 2/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | POLB | P06746 | 2/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.31 |
| ▸ | MAPT | P10636 | 2/20 | 0.31 |
| ▸ | HPGD | P15428 | 2/20 | 0.31 |
| ▸ | RECQL | P46063 | 2/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | BCHE | P06276 | 1/20 | 0.31 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.31 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.31 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL346445 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL347024 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL346555 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL345938 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL345929 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL346524 | 1.00 | F13A1 (0.33) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL3747455 | 0.93 | F13A1 (0.38) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL8503573 | 0.93 | F13A1 (0.38) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL7896830 | 0.93 | F13A1 (0.38) | F13A1TTRMEN1ALDH1A1POLB | |
| SCHEMBL3680611 | 0.85 | TTR (0.37) | TTRMEN1ALDH1A1POLBCYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| US-10580640-B2 | Kit and laminate | FUJIFILM CORPORATION (JP) | 2020-03-03 | — | — | US | disclosed |
| US-10575402-B2 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-02-25 | — | — | US | disclosed |
| US-10428253-B2 | Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2019-10-01 | — | — | US | disclosed |
| US-20190281697-A1 | RESIN COMPOSITION, WIRING LAYER LAMINATE FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2019-09-12 | — | — | US | disclosed |
| US-10287458-B2 | Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film | FUJIFILM CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-20180016471-A1 | LAMINATE, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM | FUJIFILM CORPORATION (JP) | 2018-01-18 | — | — | US | disclosed |
| US-20180012751-A1 | KIT AND LAMINATE | FUJIFILM CORPORATION (JP) | 2018-01-11 | — | — | US | disclosed |
| US-9781836-B2 | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-10-03 | — | — | US | disclosed |
| US-20160160102-A1 | PHOTOSENSITIVE RESIN COMPOSITION, FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2016-06-09 | — | — | US | disclosed |
| EP-1235276-A1 | Semiconductor device and process for fabrication thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2002-08-28 | — | — | EP | disclosed |
| US-6372859-B1 | MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-16 | — | — | US | disclosed |
| US-20010035533-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-11-01 | — | — | US | disclosed |
| US-20010016384-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-08-23 | — | — | US | disclosed |
| US-20010009780-A1 | Semiconductor device and process for fabrication thereof | TAKEDA SHINJI (JP) | 2001-07-26 | — | — | US | disclosed |
| EP-1032036-A2 | Semiconductor device and process for fabrication thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| EP-0984051-A1 | HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-03-08 | — | — | EP | disclosed |
| EP-0837498-A1 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE | HITACHI CHEMICAL CO., LTD. (JP) | 1998-04-22 | — | — | EP | disclosed |
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | disclosed |