⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL629383 | 0.82 | — | — | |
| SCHEMBL159772 | 0.82 | — | — | |
| SCHEMBL9504748 | 0.80 | — | — | |
| SCHEMBL28949837 | 0.77 | EPHX1 (0.40) | — | |
| SCHEMBL7572254 | 0.76 | — | — | |
| SCHEMBL51799 | 0.75 | — | — | |
| SCHEMBL27077214 | 0.75 | — | — | |
| SCHEMBL28427419 | 0.75 | — | — | |
| SCHEMBL5499988 | 0.74 | USP2 (0.30) | — | |
| SCHEMBL17363896 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119698503-A | Plasma coating with particles | 施福克私人有限公司 | 2025-03-25 | — | — | CN | disclosed |
| CN-114958369-B | Organic silicon coated quantum dot material and preparation method and application thereof | 广东欧迪明光电科技股份有限公司 | 2023-04-14 | — | — | CN | disclosed |
| CN-115667408-A | Two-liquid addition curing type silicone rubber composition | 信越化学工业株式会社 | 2023-01-31 | — | — | CN | disclosed |
| CN-114958369-A | Organic silicon coated quantum dot material and preparation method and application thereof | 广东欧迪明光电科技股份有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-108473484-B | Compounds useful as TRPM8 modulators | 弗门尼舍公司 | 2021-06-29 | — | — | CN | disclosed |
| US-20160138160-A1 | REACTIVE ULTRAVIOLET THERMAL PROCESSING OF LOW DIELECTRIC CONSTANT MATERIALS | LAM RESEARCH CORPORATION | 2016-05-19 | — | — | US | disclosed |
| US-20160042943-A1 | LOW-K DIELECTRIC FILM FORMATION | LAM RESEARCH CORPORATION | 2016-02-11 | — | — | US | disclosed |
| US-9029265-B2 | Method for forming semiconductor structure | UNITED MICROELECTRONICS CORP. (TW) | 2015-05-12 | — | — | US | disclosed |
| US-20150104943-A1 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | UNITED MICROELECTRONICS CORP. (TW) | 2015-04-16 | — | — | US | disclosed |
| US-20100151151-A1 | METHOD OF FORMING LOW-K FILM HAVING CHEMICAL RESISTANCE | ASM JAPAN K.K. (JP) | 2010-06-17 | — | — | US | disclosed |