SCHEMBL3479976

SCHEMBL3479976

O=S(=O)(O)CF.[KH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL120156 0.96
SCHEMBL5761100 0.92
SCHEMBL9124564 0.92
SCHEMBL29289331 0.92
SCHEMBL3479950 0.92
Phosphine SCHEMBL2571031 0.92
SCHEMBL5084321 0.92
SCHEMBL17409640 0.92
SCHEMBL22688913 0.92
SCHEMBL29193773 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11414523-B2 Polycarbonate-polydiorganosiloxane copolymer, resin composition of polycarbonate-polydiorganosiloxane copolymer, and production method for resin composition of polycarbonate-polydiorganosiloxane copolymer TEIJIN LIMITED (JP) 2022-08-16 US disclosed
US-20210108033-A1 POLYCARBONATE-POLYDIORGANOSILOXANE COPOLYMER, RESIN COMPOSITION OF POLYCARBONATE-POLYDIORGANOSILOXANE COPOLYMER, AND PRODUCTION METHOD FOR RESIN COMPOSITION OF POLYCARBONATE-POLYDIORGANOSILOXANE COPOLYMER TEIJIN LIMITED (JP) 2021-04-15 US disclosed
EP-2821440-B1 RESIN MODIFIER, POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEM CORP (JP) 2019-06-12 EP disclosed
US-9902849-B2 Resin modifier, polycarbonate resin composition and molded article thereof MITSUBISHI CHEMICAL CORPORATION (JP) 2018-02-27 US disclosed
US-20150045483-A1 Resin Modifier, Polycarbonate Resin Composition and Molded Article Thereof MITSUBISHI RAYON CO., LTD. (JP) 2015-02-12 US disclosed
EP-2821440-A1 RESIN MODIFIER, POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY THEREOF Mitsubishi Rayon Co., Ltd. (JP) 2015-01-07 EP disclosed
EP-1669409-B1 FLAME-RETARDANT RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND METHOD OF MOLDING THE SAME PANASONIC CORP (JP) 2012-11-14 EP disclosed
US-7750069-B2 Flame-retardant resin composition, production method of the same and molding method of the same PANASONIC CORPORATION (JP) 2010-07-06 US disclosed
CN-100436524-C Flame-retardant resin composition, process for producing the same, and method of molding the same MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2008-11-26 CN disclosed
US-20070112107-A1 Flame-retardant resin composition, production method of the same and molding method of the same PANASONIC CORPORATION (JP) 2007-05-17 US disclosed
CN-1856543-A Flame-retardant resin composition, process for producing the same, and method of molding the same MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2006-11-01 CN disclosed
EP-1669409-A1 FLAME-RETARDANT RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND METHOD OF MOLDING THE SAME MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2006-06-14 EP disclosed