⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL660180 | 0.77 | TSHR (0.32) | — | |
| SCHEMBL22654275 | 0.75 | — | — | |
| SCHEMBL2029521 | 0.74 | — | — | |
| SCHEMBL1015917 | 0.74 | — | — | |
| SCHEMBL10763797 | 0.72 | — | — | |
| SCHEMBL15268258 | 0.72 | — | — | |
| SCHEMBL4727789 | 0.72 | — | — | |
| SCHEMBL1585581 | 0.71 | — | — | |
| SCHEMBL22654153 | 0.71 | — | — | |
| SCHEMBL1270341 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110007563-B | Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element | 奇美实业股份有限公司 | 2024-04-02 | — | — | CN | disclosed |
| WO-2022138857-A1 | METHOD FOR PRODUCING HYDRATED ETHYLENE-VINYL ALCOHOL COPOLYMER PELLETS | 株式会社クラレ | 2022-06-30 | — | — | WO | disclosed |
| WO-2022138858-A1 | METHOD FOR PRODUCING ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN COMPOSITION | 株式会社クラレ | 2022-06-30 | — | — | WO | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-3946131-A | Glass fibers coated with silicon containing aminimide compounds | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1976-03-23 | — | — | US | disclosed |