⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482152 | 0.75 | — | — | |
| SCHEMBL3482622 | 0.71 | — | — | |
| SCHEMBL8687890 | 0.69 | — | — | |
| SCHEMBL3482184 | 0.65 | — | — | |
| SCHEMBL6114134 | 0.65 | — | — | |
| SCHEMBL5881376 | 0.65 | — | — | |
| SCHEMBL214384 | 0.65 | — | — | |
| SCHEMBL59911 | 0.62 | — | — | |
| SCHEMBL13258463 | 0.62 | — | — | |
| Fluoride SCHEMBL27718729 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4155864-A | ENDCAPPED POLYDIMETHYLSILOXANE AND MINOR AMOUNT OF ANOTHER POLYSILOXANE; DIELECTRIC FLUIDS IN ELECTRICAL APPARATUS | UNION CARBIDE CORPORATION (US) | 1979-05-22 | — | — | US | claimed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-0713519-B1 | Middle distillate fuel oil compositions | INFINEUM USA LP (US) | 2006-07-05 | — | — | EP | disclosed |
| EP-0686182-B1 | OIL ADDITIVES AND COMPOSITIONS | INFINEUM USA LP (US) | 1999-11-03 | — | — | EP | disclosed |
| US-5833721-A | Additive for hydrocarbon oils | EXXON CHEMICAL PATENTS INC (US) | 1998-11-10 | — | — | US | disclosed |
| EP-0713519-A1 | ADDITIVE FOR HYDROCARBON OILS | EXXON CHEMICAL PATENTS INC. (US) | 1996-05-29 | — | — | EP | disclosed |
| EP-0686182-A1 | OIL ADDITIVES AND COMPOSITIONS | EXXON CHEMICAL PATENTS INC. (US) | 1995-12-13 | — | — | EP | disclosed |
| WO-1995004117-A1 | ADDITIVE FOR HYDROCARBON OILS | EXXON CHEMICAL PATENTS INC. (US) | 1995-02-09 | — | — | WO | disclosed |
| WO-1994019430-A1 | OIL ADDITIVES AND COMPOSITIONS | EXXON CHEMICAL PATENTS INC. (US) | 1994-09-01 | — | — | WO | disclosed |
| US-4155864-A | ENDCAPPED POLYDIMETHYLSILOXANE AND MINOR AMOUNT OF ANOTHER POLYSILOXANE; DIELECTRIC FLUIDS IN ELECTRICAL APPARATUS | UNION CARBIDE CORPORATION (US) | 1979-05-22 | — | — | US | disclosed |