⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481797 | 0.67 | — | — | |
| SCHEMBL234679 | 0.65 | — | — | |
| SCHEMBL10925541 | 0.63 | — | — | |
| SCHEMBL12228801 | 0.63 | — | — | |
| SCHEMBL37150 | 0.62 | — | — | |
| SCHEMBL10949705 | 0.62 | — | — | |
| SCHEMBL705604 | 0.60 | — | — | |
| SCHEMBL10794029 | 0.60 | — | — | |
| SCHEMBL20151 | 0.60 | — | — | |
| SCHEMBL3507666 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116855223-A | High-bonding-strength organic silicon bonding sealant and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | claimed |
| CN-116854923-A | Boron-containing tackifier for silicone rubber and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | claimed |
| CN-116855223-A | High-bonding-strength organic silicon bonding sealant and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | disclosed |
| CN-116854923-A | Boron-containing tackifier for silicone rubber and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |