⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482059 | 0.79 | — | — | |
| SCHEMBL3481419 | 0.75 | TSHR (0.33) | — | |
| SCHEMBL3482447 | 0.75 | TSHR (0.36) | — | |
| SCHEMBL1262042 | 0.74 | — | — | |
| SCHEMBL16062551 | 0.74 | — | — | |
| SCHEMBL1314322 | 0.74 | — | — | |
| SCHEMBL335428 | 0.72 | — | — | |
| SCHEMBL4082801 | 0.72 | — | — | |
| SCHEMBL2166951 | 0.72 | — | — | |
| SCHEMBL4086343 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1212380-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2002-06-12 | — | — | EP | claimed |
| US-6384125-B1 | CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER | DOW CORNING CORPORATION | 2002-05-07 | — | — | US | claimed |
| WO-2001014480-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2001-03-01 | — | — | WO | claimed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8791221-B2 | Addition-curable metallosiloxane compound | DAICEL CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| EP-2650319-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | Daicel Corporation (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | DAICEL CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| US-8299185-B2 | Curable cage-type silicone copolymer and process for production thereof and curable resin composition comprising curable cage-type silicone copolymer and cured product thereof | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20100280190-A1 | CURABLE CAGE-TYPE SILICONE COPOLYMER AND PROCESS FOR PRODUCTION THEREOF AND CURABLE RESIN COMPOSITION COMPRISING CURABLE CAGE-TYPE SILICONE COPOLYMER AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-1122746-B1 | Composition for film formation and insulating film | JSR CORP (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6468589-B2 | A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING | JSR CORPORATION (JP) | 2002-10-22 | — | — | US | disclosed |
| EP-1212380-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2002-06-12 | — | — | EP | disclosed |
| US-6384125-B1 | CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER | DOW CORNING CORPORATION | 2002-05-07 | — | — | US | disclosed |
| US-20010012870-A1 | Composition for film formation and insulating film | JSR CORPORATION (JP) | 2001-08-09 | — | — | US | disclosed |
| EP-1122746-A1 | Composition for film formation and insulating film | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| WO-2001014480-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2001-03-01 | — | — | WO | disclosed |