⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1585581 | 0.71 | — | — | |
| SCHEMBL22654219 | 0.69 | — | — | |
| SCHEMBL16752005 | 0.65 | — | — | |
| SCHEMBL21313676 | 0.65 | — | — | |
| SCHEMBL6561386 | 0.64 | SLC6A2 (0.33) | — | |
| SCHEMBL15301594 | 0.64 | — | — | |
| SCHEMBL22654145 | 0.62 | — | — | |
| SCHEMBL1230084 | 0.62 | — | — | |
| SCHEMBL3641102 | 0.61 | — | — | |
| SCHEMBL3858477 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1212380-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2002-06-12 | — | — | EP | claimed |
| US-6384125-B1 | CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER | DOW CORNING CORPORATION | 2002-05-07 | — | — | US | claimed |
| WO-2001014480-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2001-03-01 | — | — | WO | claimed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-1212380-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2002-06-12 | — | — | EP | disclosed |
| US-6384125-B1 | CONTACTING ACIDIC AQUEOUS SUSPENSION OF PRECIPITATED OR COLLOIDAL SILICA WITH COMBINATION OF FUNCTIONALIZING COUPLING AGENT AND ORGANOMETALLIC HYDROPHOBING COMPOUND, NEUTRALIZING TO INCREASE PH, RECOVERING MODIFIED FILLER | DOW CORNING CORPORATION | 2002-05-07 | — | — | US | disclosed |
| WO-2001014480-A1 | CHEMICALLY MODIFIED SILICA FILLERS, PROCESS FOR PRODUCING, AND SILICONE COMPOSITIONS CONTAINING SAME | DOW CORNING CORPORATION (US) | 2001-03-01 | — | — | WO | disclosed |