Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27606642 | 0.97 | — | — | |
| SCHEMBL10005616 | 0.88 | — | — | |
| SCHEMBL10005615 | 0.86 | — | — | |
| SCHEMBL6114388 | 0.86 | — | — | |
| SCHEMBL13621376 | 0.84 | — | — | |
| SCHEMBL13621344 | 0.84 | — | — | |
| SCHEMBL13621326 | 0.84 | — | — | |
| SCHEMBL5613823 | 0.84 | — | — | |
| SCHEMBL13621342 | 0.84 | — | — | |
| SCHEMBL13621374 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3039080-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DUPONT TORAY SPECIALTY MATERIALS KK (JP) | 2022-05-11 | — | — | EP | disclosed |
| CN-109661435-B | Curable resin composition, cured product thereof, and semiconductor device | 日亚化学工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| CN-110177841-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-08-27 | — | — | CN | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| CN-106255728-B | Curable silicon composition, cured product thereof, and optical semiconductor device | 陶氏东丽株式会社 | 2019-07-02 | — | — | CN | disclosed |
| CN-105960438-B | Curable silicon composition, cured product thereof, and optical semiconductor device | 陶氏东丽株式会社 | 2019-05-28 | — | — | CN | disclosed |
| CN-105492539-B | Curable organosilicon composition, its cured product and optical semiconductor device | 美国陶氏有机硅公司 | 2019-05-07 | — | — | CN | disclosed |
| CN-109661435-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-04-19 | — | — | CN | disclosed |
| EP-2772505-B1 | PHOTOCURABLE RESIN COMPOSITION AND NOVEL SILOXANE COMPOUND | ADEKA CORP (JP) | 2017-11-15 | — | — | EP | disclosed |
| US-20120126435-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORPORATION (JP) | 2012-05-24 | — | — | US | disclosed |
| CN-102471581-A | Curable composition for semiconductor encapsulation | ADEKA CORP | 2012-05-23 | — | — | CN | disclosed |
| US-7649071-B2 | Branched polysiloxane composition | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2010-01-19 | — | — | US | disclosed |
| US-20090286155-A1 | LITHIUM DIFLUOROPHOSPHATE, ELECTROLYTE CONTAINING LITHIUM DIFLUOROPHOSPHATE, PROCESS FOR PRODUCING LITHIUM DIFLUOROPHOSPHATE, PROCESS FOR PRODUCING NONAQUEOUS ELECTROLYTE, NONAQUEOUS ELECTROLYTE, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY CONTAINING THE SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2009-11-19 | — | — | US | disclosed |
| US-20090286155-A1 | LITHIUM DIFLUOROPHOSPHATE, ELECTROLYTE CONTAINING LITHIUM DIFLUOROPHOSPHATE, PROCESS FOR PRODUCING LITHIUM DIFLUOROPHOSPHATE, PROCESS FOR PRODUCING NONAQUEOUS ELECTROLYTE, NONAQUEOUS ELECTROLYTE, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY CONTAINING THE SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2009-11-19 | — | — | US | disclosed |
| US-7560167-B2 | branched polysiloxane component; paper release coating; high-speed coating processes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2009-07-14 | — | — | US | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |