⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL701926 | 0.82 | — | — | |
| SCHEMBL8728748 | 0.82 | — | — | |
| SCHEMBL3481439 | 0.81 | — | — | |
| SCHEMBL9420316 | 0.73 | — | — | |
| SCHEMBL216019 | 0.72 | — | — | |
| SCHEMBL29246292 | 0.71 | — | — | |
| SCHEMBL1493184 | 0.67 | — | — | |
| SCHEMBL2178200 | 0.66 | — | — | |
| SCHEMBL3481398 | 0.65 | — | — | |
| SCHEMBL3481632 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109661435-B | Curable resin composition, cured product thereof, and semiconductor device | 日亚化学工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| US-9657175-B2 | Silicone resin composition for sealing optical semiconductor element and optical semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-05-23 | — | — | US | disclosed |
| US-20160108240-A1 | SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-21 | — | — | US | disclosed |
| EP-2057239-B1 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MAT INC (US) | 2015-03-04 | — | — | EP | disclosed |
| EP-2057238-B1 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MAT INC (US) | 2012-10-10 | — | — | EP | disclosed |
| US-7649071-B2 | Branched polysiloxane composition | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2010-01-19 | — | — | US | disclosed |
| US-7560167-B2 | branched polysiloxane component; paper release coating; high-speed coating processes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2009-07-14 | — | — | US | disclosed |
| EP-2057238-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | Momentive Performance Materials Inc. (US) | 2009-05-13 | — | — | EP | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| WO-2008027494-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| EP-1146064-B1 | Continuous hydrosilylation method for production of modified liquid organosilicon compound | DOW CORNING TORAY SILICONE (JP) | 2004-08-11 | — | — | EP | disclosed |
| US-6410772-B2 | EFFECTING HYDROSILYLATION REACTION BETWEEN ORGANOSILICON COMPOUND HAVING AT LEAST ONE SILICON-BONDED HYDROGEN ATOM AND ORGANOSILICON COMPOUND HAVING AT LEAST ONE ALIPHATIC UNSATURATED BOND IN THE PRESENCE OF PLATINUM CATALYST | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 2002-06-25 | — | — | US | disclosed |
| US-20010043893-A1 | Continuous hydrosilylation method for production of a modified liquid organosilicon compound | DOW TORAY CO., LTD. (JP) | 2001-11-22 | — | — | US | disclosed |
| EP-1146064-A2 | Continuous hydrosilylation method for production of modified liquid organosilicon compound | Dow Corning Toray Silicone Co., Ltd. (JP) | 2001-10-17 | — | — | EP | disclosed |