⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4221288 | 0.84 | — | — | |
| SCHEMBL3629216 | 0.74 | — | — | |
| SCHEMBL388230 | 0.74 | — | — | |
| SCHEMBL335427 | 0.71 | — | — | |
| SCHEMBL3481691 | 0.69 | — | — | |
| SCHEMBL3481576 | 0.69 | — | — | |
| SCHEMBL1317650 | 0.67 | — | — | |
| SCHEMBL3482577 | 0.67 | — | — | |
| SCHEMBL29054720 | 0.67 | — | — | |
| SCHEMBL3482267 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115702176-B | Curable composition and cured product thereof | 株式会社德山 | 2024-05-03 | — | — | CN | disclosed |
| US-9969850-B2 | Method for producing modified polymer, and rubber composition | TOYO TIRE & RUBBER CO., LTD. (JP) | 2018-05-15 | — | — | US | disclosed |
| US-20160009875-A1 | METHOD FOR PRODUCING MODIFIED POLYMER, AND RUBBER COMPOSITION | TOYO TIRE & RUBBER CO., LTD. (JP) | 2016-01-14 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8299185-B2 | Curable cage-type silicone copolymer and process for production thereof and curable resin composition comprising curable cage-type silicone copolymer and cured product thereof | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20100280190-A1 | CURABLE CAGE-TYPE SILICONE COPOLYMER AND PROCESS FOR PRODUCTION THEREOF AND CURABLE RESIN COMPOSITION COMPRISING CURABLE CAGE-TYPE SILICONE COPOLYMER AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20090263631-A1 | FILM FORMING COMPOSITION FOR NANOIMPRINTING AND METHOD FOR PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7556860-B2 | Laminate and method of forming the same, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2009-07-07 | — | — | US | disclosed |
| US-20060216531-A1 | Laminate and method of forming the same, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2006-09-28 | — | — | US | disclosed |
| EP-1679184-A1 | LAMINATE AND METHOD FOR FORMATION THEREOF, INSULATING FILM, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FORMING FILM | JSR Corporation (JP) | 2006-07-12 | — | — | EP | disclosed |