⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28207225 | 0.80 | — | — | |
| SCHEMBL59125 | 0.75 | — | — | |
| SCHEMBL28020349 | 0.75 | — | — | |
| SCHEMBL202734 | 0.75 | — | — | |
| SCHEMBL3481980 | 0.72 | — | — | |
| SCHEMBL464998 | 0.72 | — | — | |
| Lithium SCHEMBL31437130 | 0.72 | — | — | |
| SCHEMBL8079689 | 0.72 | — | — | |
| Potassium SCHEMBL31135317 | 0.72 | — | — | |
| SCHEMBL27965016 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1235877-B1 | THERMOPLASTIC SILICONE ELASTOMERS BASED ON FLUOROCARBON RESIN | DOW CORNING (US) | 2005-03-23 | — | — | EP | claimed |
| EP-1235877-A1 | THERMOPLASTIC SILICONE ELASTOMERS BASED ON FLUOROCARBON RESIN | DOW CORNING CORPORATION (US) | 2002-09-04 | — | — | EP | claimed |
| WO-2001019914-A1 | THERMOPLASTIC SILICONE ELASTOMERS BASED ON FLUOROCARBON RESIN | DOW CORNING CORPORATION (US) | 2001-03-22 | — | — | WO | claimed |
| US-6015858-A | CURING; TENSILE STRENGTH, ELONGATION | DOW CORNING CORPORATION (US) | 2000-01-18 | — | — | US | claimed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-7718727-B2 | Fluoroplastic silicone vulcanizates | DOW CORNING CORPORATION (US) | 2010-05-18 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20090286935-A1 | FLUOROCARBON ELASTOMER SILICONE VULCANIZATES | DOW CORNING CORPORATION | 2009-11-19 | — | — | US | disclosed |
| EP-1641878-B1 | FLUOROPLASTIC SILICONE VULCANIZATES | DOW CORNING (US) | 2009-11-18 | — | — | EP | disclosed |
| US-20090215959-A1 | FLUOROPLASTIC SILICONE VULCANIZATES | HARTMANN MARK | 2009-08-27 | — | — | US | disclosed |
| EP-1511806-A1 | FLUOROCARBON ELASTOMER SILICONE VULCANIZATES | Dow Corning Corporation (US) | 2005-03-09 | — | — | EP | disclosed |
| EP-1509570-A1 | FLUOROCARBON ELASTOMER SILICONE VULCANIZATES | Dow Corning Corporation (US) | 2005-03-02 | — | — | EP | disclosed |
| WO-2004108822-A1 | FLUOROPLASTIC SILICONE VULCANIZATES | DOW CORNING CORPORATION (US) | 2004-12-16 | — | — | WO | disclosed |
| WO-2003104322-A1 | FLUOROCARBON ELASTOMER SILICONE VULCANIZATES | DOW CORNING CORPORATION (US) | 2003-12-18 | — | — | WO | disclosed |
| WO-2003104323-A1 | FLUOROCARBON ELASTOMER SILICONE VULCANIZATES | DOW CORNING CORPORATION (US) | 2003-12-18 | — | — | WO | disclosed |
| EP-1235877-A1 | THERMOPLASTIC SILICONE ELASTOMERS BASED ON FLUOROCARBON RESIN | DOW CORNING CORPORATION (US) | 2002-09-04 | — | — | EP | disclosed |
| WO-2001019914-A1 | THERMOPLASTIC SILICONE ELASTOMERS BASED ON FLUOROCARBON RESIN | DOW CORNING CORPORATION (US) | 2001-03-22 | — | — | WO | disclosed |
| US-6015858-A | CURING; TENSILE STRENGTH, ELONGATION | DOW CORNING CORPORATION (US) | 2000-01-18 | — | — | US | disclosed |