SCHEMBL3482685

SCHEMBL3482685

C[Si](C)(O)c1c(F)c(F)c(F)c(F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18692000 0.97
SCHEMBL19180843 0.79
SCHEMBL1905094 0.72
SCHEMBL1687076 0.72
SCHEMBL1053840 0.72
SCHEMBL1687087 0.72
SCHEMBL3160985 0.69
SCHEMBL15738607 0.67
SCHEMBL15734256 0.67
SCHEMBL15734924 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
CN-101641767-B Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device FUJITSU LTD 2013-10-30 CN disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
EP-0452725-B1 Fluorine containing diaminobenzene derivatives and its use SAGAMI CHEM RES (JP) 1995-11-08 EP disclosed
EP-0635533-A1 Polyimide-based liquid crystal aligning agent SAGAMI CHEMICAL RESEARCH CENTER (JP) 1995-01-25 EP disclosed
US-5153304-A Polyimides; liquid crystal tilting agent; water-repelling SAGAMI CHEMICAL RESEARCH CENTER (JP) 1992-10-06 US disclosed
US-5144078-A Polyimide intermediates SAGAMI CHEMICAL RESEARCH CENTER (JP) 1992-09-01 US disclosed
US-5140087-A Endcapped by a polyfluoroalkylsilanol at one end and a silanol at the other; molecular weight distribution; silicone rubbers; oil repellants CHISSO CORPORATION (JP) 1992-08-18 US disclosed
US-5098981-A POLYORGANOSILOXANE CHISSO CORPORATION (JP) 1992-03-24 US disclosed
EP-0452725-A2 Fluorine containing diaminobenzene derivatives and its use SAGAMI CHEMICAL RESEARCH CENTER (JP) 1991-10-23 EP disclosed
US-5047491-A Molding materials; waterproofing, oil repellents, antifouling agents CHISSO CORPORATION (JP) 1991-09-10 US disclosed
US-4996280-A Polyorganosiloxane compounds with amino group CHISSO CORPORATION (JP) 1991-02-26 US disclosed
US-4992521-A Oil and water repellency, stain and heat resistance, release properties CHISSO CORPORATION (JP) 1991-02-12 US disclosed
US-4987203-A Modifier of properties of epoxy resins, polyamides or polyurethanes CHISSO CORPORATION (JP) 1991-01-22 US disclosed
EP-0355497-A2 Polyorganosiloxane compounds Chisso Corporation (JP) 1990-02-28 EP disclosed
EP-0353709-A2 Polyorganosiloxane compounds with amino group Chisso Corporation (JP) 1990-02-07 EP disclosed
EP-0349920-A2 Polyorganosiloxane Chisso Corporation (JP) 1990-01-10 EP disclosed
EP-0338577-A2 Organosiloxane and process for preparing the same Chisso Corporation (JP) 1989-10-25 EP disclosed