⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3483256 | 1.00 | — | — | |
| SCHEMBL12387143 | 1.00 | — | — | |
| SCHEMBL3484095 | 1.00 | — | — | |
| SCHEMBL680313 | 0.98 | — | — | |
| SCHEMBL19999739 | 0.91 | — | — | |
| SCHEMBL30496442 | 0.88 | — | — | |
| SCHEMBL5831872 | 0.86 | — | — | |
| SCHEMBL20312543 | 0.86 | — | — | |
| SCHEMBL13007312 | 0.85 | — | — | |
| SCHEMBL9976285 | 0.85 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180057638-A1 | SILICONE RESIN SUBSTRATE, METAL LAYER-FORMED SILICONE RESIN SUBSTRATE, CURED SILICONE RESIN SUBSTRATE, AND METAL LAYER-FORMED CURED-SILICONE RESIN SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-03-01 | — | — | US | disclosed |
| US-20180057648-A1 | SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-03-01 | — | — | US | disclosed |
| US-20160322293-A1 | PRINTED WIRING BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-11-03 | — | — | US | disclosed |
| US-9403967-B2 | Curable resin composition, cured product thereof and photosemiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-08-02 | — | — | US | disclosed |
| US-9268227-B2 | UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| US-9147818-B2 | Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-09-29 | — | — | US | disclosed |
| US-20150261088-A1 | UV-CURABLE ADHESIVE SILICONE COMPOSITION, UV-CURABLE ADHESIVE SILICONE COMPOSITION SHEET, OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME | SHINETSU CHEMICAL CO (JP) | 2015-09-17 | — | — | US | disclosed |
| US-9117978-B2 | Thermosetting silicone resin sheet and method for producing the same, and light-emitting apparatus using the thermosetting silicone resin sheet and method for producing the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-08-25 | — | — | US | disclosed |
| US-8841689-B2 | Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-09-23 | — | — | US | disclosed |
| US-20140175488-A1 | HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND WHITE PIGMENT-CONTAINING LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE USING SAME AND ENCAPSULATED LIGHT EMITTING SEMICONDUCTOR DEVICE PRODUCED THEREBY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-06-26 | — | — | US | disclosed |
| US-20100213415-A1 | METAL OXIDE FINE PARTICLES, SILICONE RESIN COMPOSITION AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2010-08-26 | — | — | US | disclosed |
| US-20100213415-A1 | METAL OXIDE FINE PARTICLES, SILICONE RESIN COMPOSITION AND USE THEREOF | NITTO DENKO CORPORATION (JP) | 2010-08-26 | — | — | US | disclosed |
| EP-1256601-B1 | Silicone composition and electrically conductive silicone adhesive formed therefrom | DOW CORNING (US) | 2006-08-23 | — | — | EP | disclosed |
| EP-1176181-B1 | Silicone composition and electrically conductive silicone adhesive formed therefrom | DOW CORNING (US) | 2004-11-10 | — | — | EP | disclosed |
| EP-1256601-A1 | Silicone composition and electrically conductive silicone adhesive formed therefrom | DOW CORNING CORPORATION (US) | 2002-11-13 | — | — | EP | disclosed |
| US-6448329-B1 | ORGANOPOLYSILOXANE CONTAINING VINYL GROUPS, ORGANOHYDROGEN-POLYSILOXANE, ALUMINA FILLER, POLYETHER AND HYDROSILYLATION CATALYST; ADDITION CURABLE; HIGH THIXOTROPY; AUTOMOTIVE, ELECTRONIC, CONSTRUCTION, APPLIANCE, AEROSPACE | DOW CORNING CORPORATION | 2002-09-10 | — | — | US | disclosed |
| US-6433057-B1 | CURABLE MIXTURE OF POLYSILOXANE, POLYSILICATE, ELECTRICALLY CONDUCTIVE FILLER (SILVER, GOLD, PLATINUM, OR PALLADIUM), AND HYDROSILATION CATALYST; GOOD ADHESION AND EXCELLENT ELECTRICAL PROPERTIES; FOR USE IN GASKETS AND COATINGS | DOW CORNING CORPORATION | 2002-08-13 | — | — | US | disclosed |
| US-6361716-B1 | SUPERIOR CONDUCTIVITY; LOW VOLATILE ORGANIC COMPOUNDS, SOLVENT-FREE; GOOD ADHESION AND QUICK CURE | DOW CORNING CORPORATION | 2002-03-26 | — | — | US | disclosed |
| EP-1176181-A2 | Silicone composition and electrically conductive silicone adhesive formed therefrom | DOW CORNING CORPORATION (US) | 2002-01-30 | — | — | EP | disclosed |
| US-5686641-A | Method for the preparation of organopentasiloxanes | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1997-11-11 | — | — | US | disclosed |