SCHEMBL34930

SCHEMBL34930

CCCCN[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29090343 0.97 TSHR (0.45)
SCHEMBL29090344 0.97 TSHR (0.45)
SCHEMBL5137628 0.90
SCHEMBL29369300 0.87 EPHX1 (0.55)
SCHEMBL11096156 0.87
SCHEMBL29369770 0.87 EPHX1 (0.55)
SCHEMBL1061555 0.87 EPHX1 (0.55)
SCHEMBL4075579 0.87
SCHEMBL18991339 0.87 EPHX1 (0.55)
SCHEMBL18991355 0.87 EPHX1 (0.55)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 671 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260035783-A1 SIN FILM EMBEDDING METHOD AND FILM FORMATION APPARATUS TOKYO ELECTRON LTD (JP) 2026-02-05 US claimed
US-20250226177-A1 FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING TOKYO ELECTRON LIMITED (JP) 2025-07-10 US claimed
US-12344933-B2 SiN film embedding method TOKYO ELECTRON LIMITED (JP) 2025-07-01 US claimed
US-12288671-B2 Film deposition apparatus for fine pattern forming TOKYO ELECTRON LIMITED (JP) 2025-04-29 US claimed
WO-2025027254-A1 THERMOSETTING COMPOSITE RESINS REPAIRABLE UNDER OSCILLATING MAGNETIC STIMULUS, FOR INSULATING POWER MODULES SAFRAN (FR) 2025-02-06 WO claimed
EP-2888385-B2 COATED STEEL STRIP OR SHEET HAVING ADVANTAGEOUS PROPERTIES TATA STEEL IJMUIDEN BV (NL) 2024-11-13 EP claimed
CN-118213269-A Semiconductor device and method for manufacturing the same 铠侠股份有限公司 2024-06-18 CN claimed
US-20240096595-A1 FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING TOKYO ELECTRON LIMITED (JP) 2024-03-21 US claimed
US-11881379-B2 Film deposition apparatus for fine pattern forming TOKYO ELECTRON LIMITED (JP) 2024-01-23 US claimed
EP-4288579-A1 COMPOSITION FOR ATOMIC LAYER DEPOSITION OF HIGH QUALITY SILICON OXIDE THIN FILMS Versum Materials US, LLC (US) 2023-12-13 EP claimed
US-20060278952-A1 Semiconductor device and fabrication process thereof FUJITSU LIMITED (JP) 2006-12-14 US claimed
US-7037803-B2 Manufacture of semiconductor device having STI and semiconductor device manufactured FUJITSU LIMITED (JP) 2006-05-02 US claimed
CN-1243044-C Soakage reversibly variable temperature-responsive copolymer film preparation method CHINESE ACAD INST CHEMISTRY (CN) 2006-02-22 CN claimed
CN-1569933-A Soakage reversibly variable temperature-responsive copolymer film preparation method CHINESE ACAD INST CHEMISTRY (CN) 2005-01-26 CN claimed
US-20040115897-A1 Manufacture of semiconductor device having STI and semiconductor device manufactured FUJITSU LIMITED (JP) 2004-06-17 US claimed
EP-1040165-B1 A POLYSILOXANE HAVING A COPOLYMER DISPERSED THEREIN AND SEALANTS CONTAINING THE SAME TREMCO INC (US) 2002-06-12 EP claimed
US-6403711-B1 BINDER IN CAULKS AND SEALANTS; ADDITION FREE RADICALLY POLYMERIZING LOW AND HIGH TG POLYMER-FORMING MONOMERS IN THE PRESENCE OF POLYSILOXANE NOVEON IP HOLDINGS CORP. 2002-06-11 US claimed
JP-2002508426-A 2002-03-19 JP claimed
EP-1040165-A1 A POLYSILOXANE HAVING A COPOLYMER DISPERSED THEREIN AND SEALANTS CONTAINING THE SAME The B.F. Goodrich Company (US) 2000-10-04 EP claimed
WO-1999031179-A1 A POLYSILOXANE HAVING A COPOLYMER DISPERSED THEREIN AND SEALANTS CONTAINING THE SAME THE B.F. GOODRICH COMPANY (US) 1999-06-24 WO claimed