SCHEMBL351664

SCHEMBL351664

C=CCOCC(=C)C(=O)OCCCCC

nearest known ligand 0.51

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.51
HPGD P15428 1/20 0.42
NAAA Q02083 1/20 0.40
HCAR2 Q8TDS4 2/20 0.39
CES2 O00748 2/20 0.39
RAD52 P43351 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
EPHX1 P07099 1/20 0.38
ATM Q13315 1/20 0.37
TDP1 Q9NUW8 1/20 0.36
PLA2G2C Q5R387 1/20 0.35
ALDH1A1 P00352 2/20 0.35
CYP3A4 P08684 2/20 0.35
TP53 P04637 1/20 0.35
MAPK1 P28482 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL351565 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL350951 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL350682 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL352225 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL353366 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL352700 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL352231 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL353117 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL350718 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2
SCHEMBL351982 0.98 TSHR (0.54) TSHRHPGDNAAAHCAR2CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11987658-B2 Curable resin composition and method of manufacturing article CANON KABUSHIKI KAISHA (JP) 2024-05-21 US disclosed
CN-111849361-B Adhesive composition for optical use, and adhesive film and adhesive sheet each using the same 藤森工业株式会社 2024-01-12 CN disclosed
WO-2023248976-A1 POLYMER AND METHOD FOR PRODUCING SAME, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND MONOMER COMPOUND AND METHOD FOR PRODUCING SAME 株式会社日本触媒 2023-12-28 WO disclosed
WO-2023189284-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET 王子ホールディングス株式会社 2023-10-05 WO disclosed
WO-2023162889-A1 POLYMER AND PHOTOSENSITIVE RESIN COMPOSITION THEREOF 株式会社日本触媒 2023-08-31 WO disclosed
US-20230140373-A1 Ultra-Thin Glass Comprising Coating Layer, and Method for Manufacturing the Same DONGWOO FINE-CHEM CO., LTD. (KR) 2023-05-04 US disclosed
CN-115210271-A N-substituted maleimide polymer and process for producing the same 株式会社日本触媒 2022-10-18 CN disclosed
US-20220282013-A1 CURABLE RESIN COMPOSITION AND METHOD OF MANUFACTURING ARTICLE CANON KABUSHIKI KAISHA (JP) 2022-09-08 US disclosed
CN-111542554-B Polymer, curable resin composition, and use thereof 株式会社日本触媒 2022-03-18 CN disclosed
WO-2021039799-A1 CURABLE COMPOSITION 株式会社日本触媒 2021-03-04 WO disclosed
CN-111849361-A Optical adhesive composition, and adhesive film and adhesive sheet using same 藤森工业株式会社 2020-10-30 CN disclosed
CN-111542554-A Polymer, curable resin composition, and use thereof 株式会社日本触媒 2020-08-14 CN disclosed
WO-2020162475-A1 CURABLE RESIN COMPOSITION キヤノン株式会社 2020-08-13 WO disclosed
US-20180037758-A1 Ink Composition For Three-Dimensional Modeling, Ink Set, And Method For Producing Three-Dimensional Model Konica Minolta, Inc. (JP) 2018-02-08 US disclosed
EP-2415751-B1 ALPHA-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF NIPPON CATALYTIC CHEM IND (JP) 2014-11-26 EP disclosed
US-8796492-B2 α-(unsaturated alkoxyalkyl) acrylate composition and process for production thereof NIPPON SHOKUBAI CO., LTD. (JP) 2014-08-05 US disclosed
EP-2415751-A1 ALPHA-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF Nippon Shokubai Co., Ltd. (JP) 2012-02-08 EP disclosed
US-20120016095-A1 a-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF NIPPON SHOKUBAI CO., LTD. (JP) 2012-01-19 US disclosed