SCHEMBL353053

SCHEMBL353053

C=CCOCC(=C)C(=O)OCC(CC)CCCC

nearest known ligand 0.56

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.56
CYP3A4 P08684 5/20 0.48
TDP1 Q9NUW8 3/20 0.48
ATM Q13315 1/20 0.48
ALDH1A1 P00352 6/20 0.43
CA2 P00918 3/20 0.43
RECQL P46063 1/20 0.41
LMNA P02545 3/20 0.40
MAPK1 P28482 3/20 0.40
HSD17B10 Q99714 1/20 0.39
PRSS1 P07477 1/20 0.39
PRSS2 P07478 1/20 0.39
PRSS3 P35030 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.38
MMP9 P14780 1/20 0.37
MMP8 P22894 1/20 0.37
MMP14 P50281 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19206911 0.90 TSHR (0.43) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL1520776 0.89 TSHR (0.56) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL26927521 0.84 TSHR (0.51) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL28242417 0.81 TSHR (0.58) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL16412767 0.80 TSHR (0.59) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL353052 0.79 TSHR (0.46) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL4374379 0.79 TSHR (0.56) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL5013183 0.79 TSHR (0.58) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL22442109 0.79 CYP3A4 (0.61) TSHRCYP3A4TDP1ATMALDH1A1
SCHEMBL352761 0.79 TSHR (0.47) TSHRTDP1ATMALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023189284-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET 王子ホールディングス株式会社 2023-10-05 WO disclosed
WO-2023162889-A1 POLYMER AND PHOTOSENSITIVE RESIN COMPOSITION THEREOF 株式会社日本触媒 2023-08-31 WO disclosed
WO-2023127300-A1 NON-AQUEOUS SECONDARY BATTERY BINDER POLYMER, NON-AQUEOUS SECONDARY BATTERY BINDER COMPOSITION, AND NON-AQUEOUS SECONDARY BATTERY ELECTRODE 株式会社レゾナック 2023-07-06 WO disclosed
CN-111542554-B Polymer, curable resin composition, and use thereof 株式会社日本触媒 2022-03-18 CN disclosed
CN-111542554-A Polymer, curable resin composition, and use thereof 株式会社日本触媒 2020-08-14 CN disclosed
WO-2020162475-A1 CURABLE RESIN COMPOSITION キヤノン株式会社 2020-08-13 WO disclosed
US-20180037758-A1 Ink Composition For Three-Dimensional Modeling, Ink Set, And Method For Producing Three-Dimensional Model Konica Minolta, Inc. (JP) 2018-02-08 US disclosed
EP-2415751-B1 ALPHA-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF NIPPON CATALYTIC CHEM IND (JP) 2014-11-26 EP disclosed
US-8796492-B2 α-(unsaturated alkoxyalkyl) acrylate composition and process for production thereof NIPPON SHOKUBAI CO., LTD. (JP) 2014-08-05 US disclosed
EP-2415751-A1 ALPHA-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF Nippon Shokubai Co., Ltd. (JP) 2012-02-08 EP disclosed
US-20120016095-A1 a-(UNSATURATED ALKOXYALKYL) ACRYLATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF NIPPON SHOKUBAI CO., LTD. (JP) 2012-01-19 US disclosed