SCHEMBL353292

SCHEMBL353292

C=CC(=O)OCCCCCC1CO1

nearest known ligand 0.63

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.63
ALDH1A1 P00352 7/20 0.63
CYP3A4 P08684 2/20 0.63
HPGD P15428 1/20 0.49
TP53 P04637 3/20 0.44
HIF1A Q16665 3/20 0.44
HSD17B10 Q99714 1/20 0.44
THRB P10828 2/20 0.35
MAPK1 P28482 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
HCAR2 Q8TDS4 1/20 0.33
EPHX1 P07099 1/20 0.33
TDP1 Q9NUW8 1/20 0.32
ATM Q13315 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7707036 1.00 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL2143538 1.00 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL8943825 1.00 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL8982096 1.00 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL8943372 1.00 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL1355256 0.98 TSHR (0.60) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL1318703 0.93 TSHR (0.57) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL20505341 0.93 TSHR (0.57) TSHRALDH1A1CYP3A4HPGDTP53
Methacrylic Acid SCHEMBL19136847 0.90 TSHR (0.51) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL10479956 0.88 TSHR (0.51) TSHRALDH1A1CYP3A4HPGDTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 451 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112241107-B Positive photosensitive resin composition, photosensitive resin film and display device using the same 株式会社东进世美肯 2025-03-11 CN claimed
CN-110967927-B Photosensitive resin composition and display device including the same 三星显示有限公司 2025-01-28 CN claimed
EP-3397693-B1 MODIFIED ASPHALT USING EPOXIDE-CONTAINING POLYMERS DOW GLOBAL TECHNOLOGIES LLC (US) 2024-10-09 EP claimed
CN-117866561-A Adhesive and preparation method and application thereof 广东省科学院化工研究所 2024-04-12 CN claimed
EP-4010382-B1 POLYMER LATEX COMPOSITION FOR THE PREPARATION OF AN ELASTOMERIC FILM HAVING SELF-HEALING PROPERTIES SYNTHOMER SDN BHD (MY) 2024-03-20 EP claimed
CN-114381156-B Metal oxide dispersion composition, method for producing same, film composition containing same, optical film, and optical element 凯斯科技股份有限公司 2024-03-12 CN claimed
CN-115710438-B Metal oxide dispersion, thin film composition for display, and optical element for display 凯斯科技股份有限公司 2024-01-30 CN claimed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN claimed
CN-113169335-B Electrode composition for cathode of battery cell of lithium ion battery, cathode slurry composition containing same, cathode and battery 阿朗新科德国有限责任公司 2023-10-13 CN claimed
CN-116068853-A Photosensitive resin composition and display device 三星显示有限公司 2023-05-05 CN claimed
US-20140114025-A1 VULCANIZABLE COMPOSITIONS BASED ON NITRILE RUBBERS CONTAINING EPOXY GROUPS LANXESS DEUTSCHLAND GMBH (DE) 2014-04-24 US claimed
US-20140114026-A1 COMPOSITIONS THAT CAN BE VULCANIZED AND THAT ARE BASED ON NITRILE RUBBERS CONTAINING EPOXY GROUPS LANXESS DEUTSCHLAND GMBH (DE) 2014-04-24 US claimed
US-8563214-B2 Radiation sensitive resin composition and method of forming an interlayer insulating film SHARP CORPORATION (JP) 2013-10-22 US claimed
US-8409783-B2 Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2013-04-02 US claimed
US-7371499-B2 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-05-13 US claimed
US-20070128540-A1 PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-06-07 US claimed
US-20060275700-A1 Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same SAMSUNG ELECTRONICS CO., LTD. 2006-12-07 US claimed
US-5530036-A STORAGE STABLE THERMOSETTING RESIN COMPOSITIONS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-06-25 US claimed
US-5399604-A Thermosetting resin composition comprising /A/ copolymer of unsaturated carboxylic acid or anhydride, unsaturated compound with epoxy group, unsaturated carboxylic acid ester or other vinyl compound, /B/ organic solvent, /C/ silane coupler JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-03-21 US claimed
US-5061587-A Image fixing at high speed RICOH COMPANY LTD. (JP) 1991-10-29 US claimed