SCHEMBL355458

SCHEMBL355458

O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].[Al+3].[La+3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17557409 0.94
SCHEMBL11356945 0.94
SCHEMBL8503530 0.94
SCHEMBL17262 0.94
SCHEMBL137694 0.94
SCHEMBL8529454 0.94
SCHEMBL7225807 0.88
SCHEMBL913498 0.88
SCHEMBL1370871 0.88
SCHEMBL1367445 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9721654-B1 Memory device KABUSHIKI KAISHA TOSHIBA (JP) 2017-08-01 US claimed
US-20160071853-A1 SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2016-03-10 US claimed
US-8779503-B2 Nonvolatile semiconductor memory KABUSHIKI KAISHA TOSHIBA (JP) 2014-07-15 US claimed
EP-1782474-B1 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2013-11-27 EP claimed
US-20130056819-A1 NONVOLATILE SEMICONDUCTOR MEMORY KABUSHIKI KAISHA TOSHIBA (JP) 2013-03-07 US claimed
US-20130015518-A1 SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2013-01-17 US claimed
US-8193577-B2 Nonvolatile semiconductor memory device KABUSHIKI KAISHA TOSHIBA (JP) 2012-06-05 US claimed
US-8071447-B2 Semiconductor device manufacturing method KABUSHIKI KAISHA TOSHIBA (JP) 2011-12-06 US claimed
US-20100203704-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD KABUSHIKI KAISHA TOSHIBA (JP) 2010-08-12 US claimed
US-20100072535-A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE TOSHIBA MEMORY CORPORATION (JP) 2010-03-25 US claimed
US-7473969-B2 High strain glass/glass-ceramic containing semiconductor-on-insulator structures CORNING INCORPORATED (US) 2009-01-06 US claimed
EP-1782474-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES Corning Incorporated (US) 2007-05-09 EP claimed
WO-2006023594-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INCORPORATED (US) 2006-03-02 WO claimed
US-20060038228-A1 High strain glass/glass-ceramic containing semiconductor-on-insulator structures CORNING INCORPORATED 2006-02-23 US claimed
US-10658480-B2 Memory device TOSHIBA MEMORY CORPORATION (JP) 2020-05-19 US disclosed
US-20190296118-A1 MEMORY DEVICE TOSHIBA MEMORY CORPORATION (JP) 2019-09-26 US disclosed
US-10008509-B2 Non-volatile semiconductor memory device TOSHIBA MEMORY CORPORATION (JP) 2018-06-26 US disclosed
US-20030063629-A1 Multimode fiber laser gratings CORNING INCORPORATED 2003-04-03 US disclosed
US-20020159736-A1 Cladding-pumped 3-level fiber laser/amplifier CORNING INCORPORATED 2002-10-31 US disclosed
EP-1246321-A2 Cladding-pumped 3-level fiber laser/amplifier CORNING INCORPORATED (US) 2002-10-02 EP disclosed