⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Silicate SCHEMBL6881647 | 0.94 | — | — | |
| Silicate SCHEMBL1974113 | 0.88 | — | — | |
| Silicate SCHEMBL3487326 | 0.88 | — | — | |
| Silicate SCHEMBL11786831 | 0.88 | — | — | |
| Silicate SCHEMBL8679579 | 0.88 | — | — | |
| Silicate SCHEMBL3622204 | 0.88 | — | — | |
| Silicate SCHEMBL11059236 | 0.88 | — | — | |
| Silicate SCHEMBL2485472 | 0.88 | — | — | |
| Silicate SCHEMBL22069932 | 0.88 | — | — | |
| Silicate SCHEMBL9842251 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090098350-A1 | CONDUCTOR COMPOSITION V | E. I. DU PONT DE NEMOURS AND COMPANY | 2009-04-16 | — | — | US | claimed |
| EP-1465209-B1 | Conductor compositions for use in electronic circuits | DU PONT (US) | 2007-10-03 | — | — | EP | claimed |
| US-20040222407-A1 | Conductor compositions for use in electronic circuits | E.I. DU PONT DE NEMOURS AND COMPANY | 2004-11-11 | — | — | US | claimed |
| EP-1465209-A1 | Conductor compositions for use in electronic circuits | E.I. du Pont de Nemours and Company (US) | 2004-10-06 | — | — | EP | claimed |
| EP-0519175-B1 | Method for making multilayer electronic circuits | DU PONT (US) | 1995-09-06 | — | — | EP | claimed |
| EP-0519175-A2 | Method for making multilayer electronic circuits | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-12-23 | — | — | EP | claimed |
| US-5162062-A | Applying thick film dielectric and conductor pastes in succession, air cofiring layers | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-11-10 | — | — | US | claimed |
| US-8257618-B2 | Conductor composition V | E I DU PONT DE NEMOURS AND COMPANY (US) | 2012-09-04 | — | — | US | disclosed |
| US-8097062-B2 | High resistivity electroconductive patterns; solderability; economical; such as liquid dispersion containing silver particles, glass frit binder and zinc; automobile window defrosting and/or demisting | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2012-01-17 | — | — | US | disclosed |
| US-20110220852-A1 | CONDUCTOR COMPOSITION V | E. I. DU PONT DE NEMOURS AND COMPANY (DE) | 2011-09-15 | — | — | US | disclosed |
| US-20110140055-A1 | CONDUCTIVE COMPOSITIONS AND THE USE THEREOF | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2011-06-16 | — | — | US | disclosed |
| US-7935168-B2 | Screen printing high resistivity electroconductive patterns using finely divided particles of such as silver particles, inorganic binder and zinc metal or alloy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2011-05-03 | — | — | US | disclosed |
| US-7914709-B2 | Conductor compositions and the use thereof | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2011-03-29 | — | — | US | disclosed |
| EP-1218891-A1 | CONDUCTOR COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2002-07-03 | — | — | EP | disclosed |
| WO-2001027941-A1 | CONDUCTOR COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2001-04-19 | — | — | WO | disclosed |
| EP-0716430-B1 | Thick film conductor compositions with improved adhesion | DU PONT (US) | 2000-02-16 | — | — | EP | disclosed |
| EP-0716430-A1 | Thick film conductor compositions with improved adhesion | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1996-06-12 | — | — | EP | disclosed |
| US-5518663-A | SOLDERING | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1996-05-21 | — | — | US | disclosed |
| EP-0457001-A1 | Glass for multichannel plates | Corning Incorporated (US) | 1991-11-21 | — | — | EP | disclosed |
| US-5034354-A | Lead silicate glass for packages of glass rods or aperture plates | CORNING INCORPORATED (US) | 1991-07-23 | — | — | US | disclosed |