⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5174140 | 0.91 | — | — | |
| SCHEMBL87725 | 0.91 | — | — | |
| SCHEMBL28404444 | 0.91 | — | — | |
| SCHEMBL53441 | 0.91 | — | — | |
| SCHEMBL563427 | 0.91 | — | — | |
| SCHEMBL3487331 | 0.83 | — | — | |
| SCHEMBL17511748 | 0.83 | — | — | |
| SCHEMBL21352582 | 0.83 | — | — | |
| SCHEMBL21352618 | 0.83 | — | — | |
| SCHEMBL9842262 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090098350-A1 | CONDUCTOR COMPOSITION V | E. I. DU PONT DE NEMOURS AND COMPANY | 2009-04-16 | — | — | US | claimed |
| CN-100358053-C | Conductor component for electronic circuit | DU PONT (US) | 2007-12-26 | — | — | CN | claimed |
| EP-1465209-B1 | Conductor compositions for use in electronic circuits | DU PONT (US) | 2007-10-03 | — | — | EP | claimed |
| US-20040222407-A1 | Conductor compositions for use in electronic circuits | E.I. DU PONT DE NEMOURS AND COMPANY | 2004-11-11 | — | — | US | claimed |
| CN-1536587-A | Conductor component for electronic circuit | E��I�����¶��Ű˾ | 2004-10-13 | — | — | CN | claimed |
| EP-1465209-A1 | Conductor compositions for use in electronic circuits | E.I. du Pont de Nemours and Company (US) | 2004-10-06 | — | — | EP | claimed |
| CN-1031446-C | Making method fo multi-layer electronic circuit | DU PONT (US) | 1996-03-27 | — | — | CN | claimed |
| EP-0519175-B1 | Method for making multilayer electronic circuits | DU PONT (US) | 1995-09-06 | — | — | EP | claimed |
| CN-1068007-A | The manufacture method of fo multi-layer electronic circuit | E I DU PONT DE NEMOUTS & CO (US) | 1993-01-13 | — | — | CN | claimed |
| EP-0519175-A2 | Method for making multilayer electronic circuits | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-12-23 | — | — | EP | claimed |
| US-5162062-A | Applying thick film dielectric and conductor pastes in succession, air cofiring layers | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-11-10 | — | — | US | claimed |
| US-8257618-B2 | Conductor composition V | E I DU PONT DE NEMOURS AND COMPANY (US) | 2012-09-04 | — | — | US | disclosed |
| US-8097062-B2 | High resistivity electroconductive patterns; solderability; economical; such as liquid dispersion containing silver particles, glass frit binder and zinc; automobile window defrosting and/or demisting | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2012-01-17 | — | — | US | disclosed |
| US-20110220852-A1 | CONDUCTOR COMPOSITION V | E. I. DU PONT DE NEMOURS AND COMPANY (DE) | 2011-09-15 | — | — | US | disclosed |
| US-20110140055-A1 | CONDUCTIVE COMPOSITIONS AND THE USE THEREOF | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2011-06-16 | — | — | US | disclosed |
| US-5518663-A | SOLDERING | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1996-05-21 | — | — | US | disclosed |
| CN-1031446-C | Making method fo multi-layer electronic circuit | DU PONT (US) | 1996-03-27 | — | — | CN | disclosed |
| CN-1068007-A | The manufacture method of fo multi-layer electronic circuit | E I DU PONT DE NEMOUTS & CO (US) | 1993-01-13 | — | — | CN | disclosed |
| EP-0457001-A1 | Glass for multichannel plates | Corning Incorporated (US) | 1991-11-21 | — | — | EP | disclosed |
| US-5034354-A | Lead silicate glass for packages of glass rods or aperture plates | CORNING INCORPORATED (US) | 1991-07-23 | — | — | US | disclosed |