⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1577434 | 1.00 | — | — | |
| SCHEMBL1814545 | 0.94 | — | — | |
| SCHEMBL28394355 | 0.77 | — | — | |
| SCHEMBL18040853 | 0.76 | — | — | |
| SCHEMBL331226 | 0.76 | — | — | |
| SCHEMBL331450 | 0.76 | — | — | |
| SCHEMBL331809 | 0.76 | — | — | |
| SCHEMBL15254360 | 0.73 | — | — | |
| SCHEMBL23152025 | 0.69 | — | — | |
| SCHEMBL27002539 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024116693-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DIE ATTACHMENT MATERIAL, CURED PRODUCT AND ELECTRONIC DEVICE | ナミックス株式会社 | 2024-06-06 | — | — | WO | disclosed |
| US-20240166795-A1 | XYLYLENE DIISOCYNATE COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF | WANHUA CHEMICAL GROUP CO., LTD. (CN) | 2024-05-23 | — | — | US | disclosed |
| EP-4372030-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4372021-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| US-20240139732-A1 | MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME | TRUVIAN SCIENCES, INC. (US) | 2024-05-02 | — | — | US | disclosed |
| EP-4361193-A1 | EPOXY RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2024-05-01 | — | — | EP | disclosed |
| WO-2024048612-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT | 株式会社クレハ | 2024-03-07 | — | — | WO | disclosed |
| EP-2075271-A1 | METHOD FOR PRODUCING RESIN FOR OPTICAL MATERIAL | Mitsui Chemicals, Inc. (JP) | 2009-07-01 | — | — | EP | disclosed |
| EP-2036951-A1 | POLYMERIZABLE COMPOSITION, RESIN USING THE SAME, OPTICAL COMPONENT AND LENS | Mitsui Chemicals, Inc. (JP) | 2009-03-18 | — | — | EP | disclosed |
| EP-2014700-A1 | POLYMERIZABLE COMPOSITION, RESIN USING THE SAME AND OPTICAL COMPONENT | Mitsui Chemicals, Inc. (JP) | 2009-01-14 | — | — | EP | disclosed |
| EP-1988110-A1 | INTERNAL MOLD RELEASE AGENT FOR PRODUCTION OF POLYTHIOURETHANE OPTICAL MATERIAL | Mitsui Chemicals, Inc. (JP) | 2008-11-05 | — | — | EP | disclosed |
| EP-1988109-A1 | POLYMERIZABLE COMPOSITION FOR POLYTHIOURETHANE OPTICAL MATERIAL | Mitsui Chemicals, Inc. (JP) | 2008-11-05 | — | — | EP | disclosed |
| US-7396900-B2 | Thiourethane-based optical material | MITSUI CHEMICALS, INC. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7244808-B2 | Thiourethane-based optical material | MITSUI CHEMICALS, INC. (JP) | 2007-07-17 | — | — | US | disclosed |
| US-20070149822-A1 | Thiourethane-based optical material | MITSUI CHEMICALS, INC. (JP) | 2007-06-28 | — | — | US | disclosed |
| US-20050131203-A1 | Thiourethane-based optical material | MITSUI CHEMICALS, INC. (JP) | 2005-06-16 | — | — | US | disclosed |
| EP-1505094-A1 | THIOURETHANE-BASED OPTICAL MATERIAL | Mitsui Chemicals, Inc. (JP) | 2005-02-09 | — | — | EP | disclosed |