Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL597423 | 0.78 | TSHR (0.37) | TSHRTDP1 | |
| SCHEMBL11302559 | 0.78 | TSHR (0.37) | TSHRTDP1 | |
| SCHEMBL8966812 | 0.76 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL1404386 | 0.76 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL23630874 | 0.76 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL11301232 | 0.72 | TSHR (0.32) | TSHRTDP1 | |
| SCHEMBL4274903 | 0.71 | — | — | |
| SCHEMBL11572548 | 0.70 | TSHR (0.30) | TSHRTDP1 | |
| SCHEMBL28674197 | 0.69 | — | — | |
| SCHEMBL11229529 | 0.67 | TSHR (0.32) | TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7771559-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-7528488-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-05 | — | — | US | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20060263599-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060260744-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |