Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.64 |
| ▸ | ABCC4 | O15439 | 1/20 | 0.64 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.55 |
| ▸ | LMNA | P02545 | 2/20 | 0.55 |
| ▸ | TSHR | P16473 | 3/20 | 0.42 |
| ▸ | LPAR3 | Q9UBY5 | 2/20 | 0.41 |
| ▸ | LPAR2 | Q9HBW0 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.40 |
| ▸ | USP2 | O75604 | 2/20 | 0.40 |
| ▸ | RECQL | P46063 | 1/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | DAGLA | Q9Y4D2 | 1/20 | 0.35 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 2/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22493539 | 1.00 | MAPT (0.64) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL22493545 | 1.00 | MAPT (0.64) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL22493538 | 1.00 | MAPT (0.64) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL22493561 | 1.00 | MAPT (0.64) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL22493554 | 1.00 | MAPT (0.64) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL11067606 | 0.90 | — | — | |
| SCHEMBL5612431 | 0.80 | MAPT (0.70) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL5363934 | 0.80 | MAPT (0.70) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL3960154 | 0.80 | MAPT (0.70) | MAPTABCC4ALDH1A1LMNATSHR | |
| SCHEMBL3170373 | 0.80 | MAPT (0.70) | MAPTABCC4ALDH1A1LMNATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114891070-A | Anthelmintic depsipeptide compounds | 勃林格殷格翰动物保健美国公司 | 2022-08-12 | — | — | CN | disclosed |
| US-11111348-B2 | Method for treating surface of resin material layer and resin material | MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) | 2021-09-07 | — | — | US | disclosed |
| EP-3450488-B1 | METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL | MITSUBISHI HEAVY IND LTD (JP) | 2021-03-24 | — | — | EP | disclosed |
| CN-107986942-B | Synthesis method of hexafluoro-1-butanol | 湖南有色郴州氟化学有限公司 | 2020-12-08 | — | — | CN | disclosed |
| US-20200317876-A1 | METHOD FOR TREATING SURFACE OF RESIN MATERIAL LAYER AND RESIN MATERIAL | MITSUBISHI HEAVY INDUSTRIES, LTD. (JP) | 2020-10-08 | — | — | US | disclosed |
| US-9127114-B2 | Curable fluorine-containing polymer composition | DAIKIN INDUSTRIES, LTD. (JP) | 2015-09-08 | — | — | US | disclosed |
| US-9018306-B2 | Curable fluorine-containing polymer composition | DOW CORNING CORPORATION (US) | 2015-04-28 | — | — | US | disclosed |
| EP-2159261-B1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | DOW CORNING (US) | 2012-12-26 | — | — | EP | disclosed |
| EP-2075285-B1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | DAIKIN IND LTD (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20100210769-A1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | DOW CORNING CORPORATION (US) | 2010-08-19 | — | — | US | disclosed |
| US-20100113700-A1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | UMEDA CENTER BUILDING (JP) | 2010-05-06 | — | — | US | disclosed |
| EP-2159261-A1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | Dow Corning Corporation (US) | 2010-03-03 | — | — | EP | disclosed |
| EP-2075285-A1 | CURABLE FLUORINE-CONTAINING POLYMER COMPOSITION | Daikin Industries, Ltd. (JP) | 2009-07-01 | — | — | EP | disclosed |
| US-6284317-B1 | PROVIDING SURFACE COMPRISING UNITS HAVING SILION-HYDROGEN BONDS; EXPOSING TO ORGANOMETALLIC REAGENT; FORMING A SILICON-CARBON BOND AT A TEMPERATURE OF LESS THAN ABOUT 25.DEGREE. C. AND FREE OF AN EXTERNAL ENERGY SOURCE | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2001-09-04 | — | — | US | disclosed |