SCHEMBL3650265

SCHEMBL3650265

CCCCCC(=O)c1ccc(O)c(O)c1O

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 3/20 0.63
MAPT P10636 3/20 0.53
PLA2G2A P14555 2/20 0.53
PLA2G5 P39877 2/20 0.53
ALDH1A1 P00352 2/20 0.53
FFAR1 O14842 1/20 0.53
MEN1 O00255 1/20 0.53
KMT2A Q03164 1/20 0.53
ATM Q13315 1/20 0.53
HSD17B3 P37058 7/20 0.51
KDM4E B2RXH2 2/20 0.47
PIK3CA P42336 1/20 0.47
SELL P14151 1/20 0.47
SELP P16109 1/20 0.47
TLR2 O60603 1/20 0.44
NSD2 O96028 1/20 0.44
POLB P06746 1/20 0.44
PKM P14618 1/20 0.44
MPI P34949 1/20 0.44
GRK6 P43250 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10351740 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL9806374 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL8142713 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL9806444 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL3277095 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL8823487 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL10350952 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL10794438 0.98 HTT (0.61) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL10350961 0.95 HTT (0.56) HTTMAPTPLA2G2APLA2G5ALDH1A1
SCHEMBL11419973 0.91 SELL (0.56) HTTMAPTALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 116 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-4702010-A1 PHOTOACTIVE COMPOUNDS Merck Patent GmbH (DE) 2026-03-04 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
WO-2024223739-A1 PHOTOACTIVE COMPOUNDS MERCK PATENT GMBH (DE) 2024-10-31 WO disclosed
WO-2024185652-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-09-12 WO disclosed
WO-2024150700-A1 RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-07-18 WO disclosed
WO-2024143210-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
EP-0555861-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1993-08-18 EP disclosed
EP-0510446-A1 Negative-working radiation-sensitive composition and radiation-sensitive recording material produced therewith HOECHST AKTIENGESELLSCHAFT (DE) 1992-10-28 EP disclosed
US-5143816-A Lithography printing plates; good adhesion FUJI PHOTO FILM CO., LTD. (JP) 1992-09-01 US disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed
EP-0193166-B1 LIGHT-SENSITIVE COMPOSITION AND LIGHT-SENSITIVE POSITIVE REGISTRATION MATERIAL HOECHST CELANESE CORPORATION (US) 1991-05-08 EP disclosed
EP-0410760-A2 Light-sensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1991-01-30 EP disclosed
EP-0307752-A2 Poly(3-mono- and 3,5-disubstituted-4-acetoxystyrenes and 4-hydroxy-styrenes)and their use HOECHST AKTIENGESELLSCHAFT (DE) 1989-03-22 EP disclosed
EP-0193166-A2 Light-sensitive composition and light-sensitive positive registration material HOECHST CELANESE CORPORATION (US) 1986-09-03 EP disclosed
US-4588670-A Light-sensitive trisester of O-quinone diazide containing composition for the preparation of a positive-acting photoresist AMERICAN HOECHST CORPORATION (US) 1986-05-13 US disclosed