SCHEMBL36601

SCHEMBL36601

CCC1(COCc2ccc(COCC3(CC)COC3)cc2)COC1

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.38
POLB P06746 1/20 0.34
HSD17B10 Q99714 1/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
TACR1 P25103 1/20 0.32
CTSK P43235 2/20 0.31
KCNH2 Q12809 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3161401 0.98 TSHR (0.37) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL13721129 0.98 TSHR (0.37) TSHRPOLBHSD17B10MEN1KMT2A
Methoxymethane SCHEMBL28253297 0.96 TSHR (0.36) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL686052 0.95 TSHR (0.36) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL7199075 0.95 TSHR (0.36) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL18876322 0.93 TSHR (0.38) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL27615158 0.93 AGXT (0.39) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL13320413 0.92 TSHR (0.34) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL213722 0.92 IDO1 (0.43) TSHR
SCHEMBL21477304 0.92 TSHR (0.37) TSHRPOLBHSD17B10MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4613 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120044753-B Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board Hangzhou foster Electronic Materials Co.,Ltd. (CN) 2026-05-26 CN claimed
US-20260064002-A1 PHOTOSENSITIVE COMPOSITION AND FILM PREPARED FROM THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2026-03-05 US claimed
US-12344703-B2 Photo radiation curable epoxy for electrical components HITACHI ENERGY LTD (CH) 2025-07-01 US claimed
CN-116284683-B Oxygen heterocyclic end-capped resin and adhesive using same 东莞澳中新材料科技股份有限公司 2025-06-10 CN claimed
CN-120082236-A Photo-curing epoxy ink and preparation method and application thereof 万华化学集团股份有限公司 2025-06-03 CN claimed
CN-120044753-A Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board 杭州福斯特电子材料有限公司 2025-05-27 CN claimed
US-20250066548-A1 HYBRID PHOTOCURABLE COMPOSITION ARKEMA FRANCE (FR) 2025-02-27 US claimed
EP-4457565-A1 HYBRID PHOTOCURABLE COMPOSITION ARKEMA FRANCE (FR) 2024-11-06 EP claimed
CN-118901044-A Hybrid photocurable compositions 阿科玛法国公司 2024-11-05 CN claimed
CN-118546635-A LED packaging adhesive, preparation method and LED packaging method 北京康美特科技股份有限公司 2024-08-27 CN claimed
EP-1302499-A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-04-16 EP claimed
EP-1232198-A1 UV-CURABLE COMPOSITIONS Vantico AG (CH) 2002-08-21 EP claimed
US-20020033547-A1 Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization KONINKLIJKE PHILIPS ELECTRONICS N.V. (NL) 2002-03-21 US claimed
WO-2002006038-A2 METHOD OF MANUFACTURING A REPLICA AS WELL AS A REPLICA OBTAINED BY CARRYING OUT A UV LIGHT-INITIATED CATIONIC POLYMERIZATION KONINKLIJKE PHILIPS ELECTRONICS N.V. (NL) 2002-01-24 WO claimed
EP-0848294-B1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM NV (NL) 2001-09-19 EP claimed
WO-2001019895-A1 UV-CURABLE COMPOSITIONS VANTICO AG (CH) 2001-03-22 WO claimed
US-6166101-A Ultraviolet-curing coating composition for cans KANSAI PAINT CO., LTD. (JP) 2000-12-26 US claimed
EP-1031574-A1 Phosphorylated polyol, oligomer therefrom, polymer therefrom, processes for preparing them and their uses UCB S.A. (BE) 2000-08-30 EP claimed
US-5981616-A OXETANE COMPOUND, EPOXY COMPOUND CONSISTING OF EXPOXIDIZED POLYMERS OF CONJUGATED DIENE MONOMERS, EXPOXIDIZED COPOLYMERS OF DIENE MONOMERS AND COMPOUNDS HAVING AN ETHYLENICALLY UNSATURATED BOND, AND EXPOXIDIZED NATURAL RUBBER DSM N.V. (NL) 1999-11-09 US claimed
EP-0848294-A1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM N.V. (NL) 1998-06-17 EP claimed