⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5533014 | 0.92 | — | — | |
| SCHEMBL13563769 | 0.84 | — | — | |
| SCHEMBL69143 | 0.72 | — | — | |
| SCHEMBL19249362 | 0.69 | MEN1 (0.38) | — | |
| SCHEMBL8845085 | 0.69 | MEN1 (0.38) | — | |
| SCHEMBL12470582 | 0.69 | MEN1 (0.38) | — | |
| SCHEMBL18534321 | 0.69 | MEN1 (0.38) | — | |
| Hydrochloric Acid SCHEMBL16777054 | 0.69 | — | — | |
| Hydrochloric Acid SCHEMBL16777052 | 0.69 | — | — | |
| Methane SCHEMBL705841 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115152007-A | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing solder bump-attached electrode substrate | 昭和电工材料株式会社 | 2022-10-04 | — | — | CN | disclosed |
| EP-2158271-A1 | HYDROPHOBIZED LIGNOCELLULOSE, MATERIALS COMPRISING HYDROPHOBIZED LIGNOCELLULOSE, AND METHOD FOR HYDROPHOBIZING LIGNOCELLULOSE | Sasol Wax GmbH (DE) | 2010-03-03 | — | — | EP | disclosed |
| WO-2008141635-A1 | HYDROPHOBIZED LIGNOCELLULOSE, MATERIALS COMPRISING HYDROPHOBIZED LIGNOCELLULOSE, AND METHOD FOR HYDROPHOBIZING LIGNOCELLULOSE | SASOL WAX GMBH (DE) | 2008-11-27 | — | — | WO | disclosed |
| EP-0982385-B1 | ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS | FUJITSU LTD (JP) | 2004-01-28 | — | — | EP | disclosed |
| US-6576081-B2 | Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A | FUJITSU LIMITED (JP) | 2003-06-10 | — | — | US | disclosed |
| US-20020084019-A1 | Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A | FUJITSU LIMITED (JP) | 2002-07-04 | — | — | US | disclosed |
| EP-0982385-A1 | ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS | FUJITSU LIMITED (JP) | 2000-03-01 | — | — | EP | disclosed |