⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6865098 | 0.67 | — | — | |
| SCHEMBL3243273 | 0.65 | — | — | |
| SCHEMBL3252262 | 0.62 | — | — | |
| SCHEMBL3254515 | 0.60 | — | — | |
| SCHEMBL329389 | 0.59 | — | — | |
| SCHEMBL3252348 | 0.55 | — | — | |
| SCHEMBL11452000 | 0.54 | — | — | |
| SCHEMBL7942252 | 0.54 | — | — | |
| SCHEMBL14613572 | 0.51 | — | — | |
| SCHEMBL5048855 | 0.51 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| EP-4306509-A1 | XYLYLENE DIISOCYNATE COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF | Wanhua Chemical Group Co., Ltd (CN) | 2024-01-17 | — | — | EP | disclosed |
| WO-2022210261-A1 | CURABLE RESIN COMPOSITION | ナミックス株式会社 | 2022-10-06 | — | — | WO | disclosed |
| EP-2123695-B1 | METAL THIETANE COMPOUND, POLYMERIZABLE COMPOSITION COMPRISING THE COMPOUND, RESIN, AND USE OF THE RESIN | MITSUI CHEMICALS INC (JP) | 2021-06-23 | — | — | EP | disclosed |
| EP-2230271-B1 | ADDITIVE FOR POLYMERIZABLE COMPOSITION, POLYMERIZABLE COMPOSITION CONTAINING THE SAME, AND USE OF THE POLYMERIZABLE COMPOSITION | MITSUI CHEMICALS INC (JP) | 2016-09-07 | — | — | EP | disclosed |
| EP-2982706-A1 | ADDITIVE FOR POLYMERIZABLE COMPOSITION, POLYMERIZABLE COMPOSITION CONTAINING THE SAME, AND USE OF THE POLYMERIZABLE COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2016-02-10 | — | — | EP | disclosed |
| EP-2311845-B1 | COMPOUND, POLYMERIZABLE COMPOSITION, RESIN, AND USE OF THE COMPOSITION AND THE RESIN | MITSUI CHEMICALS INC (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-2230271-A1 | ADDITIVE FOR POLYMERIZABLE COMPOSITION, POLYMERIZABLE COMPOSITION CONTAINING THE SAME, AND USE OF THE POLYMERIZABLE COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2010-09-22 | — | — | EP | disclosed |
| EP-2123695-A1 | METAL THIETANE COMPOUND, POLYMERIZABLE COMPOSITION COMPRISING THE COMPOUND, RESIN, AND USE OF THE RESIN | Mitsui Chemicals, Inc. (JP) | 2009-11-25 | — | — | EP | disclosed |