⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3675549 | 0.81 | — | — | |
| SCHEMBL31351456 | 0.73 | — | — | |
| SCHEMBL340064 | 0.73 | TSHR (0.32) | — | |
| SCHEMBL1453461 | 0.70 | — | — | |
| SCHEMBL22118760 | 0.70 | — | — | |
| SCHEMBL10698049 | 0.69 | — | — | |
| SCHEMBL3481427 | 0.69 | — | — | |
| SCHEMBL9669177 | 0.69 | — | — | |
| SCHEMBL23701120 | 0.68 | — | — | |
| SCHEMBL59249 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117247747-A | Light-conversion packaging adhesive film and preparation method thereof | 上海润势科技有限公司 | 2023-12-19 | — | — | CN | disclosed |
| EP-1398353-B1 | THERMOPLASTIC RESIN COMPOSITION | KANEKA CORP (JP) | 2010-10-13 | — | — | EP | disclosed |
| US-7282535-B2 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-20040147674-A1 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2004-07-29 | — | — | US | disclosed |
| EP-1398353-A1 | THERMOPLASTIC RESIN COMPOSITION | Kaneka Corporation (JP) | 2004-03-17 | — | — | EP | disclosed |