SCHEMBL3685965

SCHEMBL3685965

CC(C)COOC(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
MAPK1 P28482 1/20 0.36
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29145915 0.81 TSHR (0.33) TSHRTDP1MAPK1
SCHEMBL9634505 0.78 MAPK1 (0.56) TSHRTDP1MAPK1ALDH1A1
SCHEMBL1262776 0.78 TSHR (0.35) TSHRTDP1MAPK1
SCHEMBL2727242 0.78
SCHEMBL20898630 0.78 TSHR (0.35) TSHRTDP1MAPK1
SCHEMBL6453142 0.78 TSHR (0.30) TSHRTDP1MAPK1
SCHEMBL840764 0.78 TSHR (0.30) TSHRTDP1MAPK1
SCHEMBL17187950 0.76 TSHR (0.39) TSHR
SCHEMBL11868471 0.76 TSHR (0.33) TSHRTDP1MAPK1
SCHEMBL16058644 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118291051-A Packaging adhesive film and solar cell module using same 上海海优威应用材料技术有限公司 2024-07-05 CN claimed
CN-111534237-A Photo-thermal dual-curing polyolefin packaging adhesive film and preparation method thereof 中山大学 2020-08-14 CN claimed
WO-2016200335-A1 MOULDED ARTICLE FROM POLYPROPYLENE COMPOSITION THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) 2016-12-15 WO claimed
CN-118291051-A Packaging adhesive film and solar cell module using same 上海海优威应用材料技术有限公司 2024-07-05 CN disclosed
CN-113795528-B Carboxylic acid modified nitrile copolymer latex, latex composition for dip forming comprising the same, and articles formed from the composition 株式会社LG化学 2024-07-05 CN disclosed
CN-114430748-B Method for recovering solvent and solvent recovery apparatus 株式会社LG化学 2024-05-10 CN disclosed
CN-113767126-B Carboxylic acid modified nitrile copolymer latex, latex composition for dip forming comprising the same, and articles formed from the composition 株式会社LG化学 2024-02-20 CN disclosed
CN-113767124-B Carboxylic acid modified nitrile copolymer latex, latex composition for dip forming comprising the same, and articles formed from the composition 株式会社LG化学 2024-01-09 CN disclosed
CN-113767127-B Carboxylic acid modified nitrile copolymer latex 株式会社LG化学 2023-10-10 CN disclosed
CN-111819224-B Vinyl resin particles and method for producing same 积水化成品工业株式会社 2023-08-08 CN disclosed
CN-114430748-A Method for recovering solvent and solvent recovery apparatus 株式会社LG化学 2022-05-03 CN disclosed
CN-111534237-A Photo-thermal dual-curing polyolefin packaging adhesive film and preparation method thereof 中山大学 2020-08-14 CN disclosed
US-20190294042-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2019-09-26 US disclosed
CN-109280311-A Thermoplastic resin composition and its molded product 旭化成株式会社 2019-01-29 CN disclosed
WO-2018186798-A1 POLYPROPYLENE COMPOSITION SUITABLE FOR EXTRUSION COATING APPLICATION THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) 2018-10-11 WO disclosed
WO-2016200335-A1 MOULDED ARTICLE FROM POLYPROPYLENE COMPOSITION THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) 2016-12-15 WO disclosed
EP-2116572-B1 GRANULATED WATER ABSORBENT CONTAINING WATER-ABSORBING RESIN AS THE MAIN COMPONENT NIPPON CATALYTIC CHEM IND (JP) 2016-09-07 EP disclosed
US-8729190-B2 Particular water-absorbent agent having water-absorbent resin as main component NIPPON SHOKUBAI CO., LTD. (JP) 2014-05-20 US disclosed
US-20100072421-A1 PARTICULAR WATER-ABSORBENT AGENT HAVING WATER-ABSORBENT RESIN AS MAIN COMPONENT NIPPON SHOKUBAI CO., LTD. (JP) 2010-03-25 US disclosed
EP-2116572-A1 GRANULATED WATER ABSORBENT CONTAINING WATER-ABSORBING RESIN AS THE MAIN COMPONENT Nippon Shokubai Co., Ltd. (JP) 2009-11-11 EP disclosed