SCHEMBL36884

SCHEMBL36884

C=COCC(C)OCC(C)OC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL812338 1.00
SCHEMBL21044868 1.00
SCHEMBL3164513 1.00
SCHEMBL17133765 1.00
SCHEMBL63808 0.91
SCHEMBL3468662 0.87 TDP1 (0.31)
SCHEMBL1115943 0.87 TDP1 (0.31)
SCHEMBL923838 0.83
SCHEMBL23064154 0.81 TDP1 (0.31)
SCHEMBL23064131 0.81 TDP1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2151 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12552948-B2 Radiation curable ink jet ink composition and ink jet method SEIKO EPSON CORPORATION (JP) 2026-02-17 US claimed
US-12545818-B2 Snap-cure flexible electrically conductive one component (1K) epoxy adhesive composition HENKEL AG & CO. KGAA (DE) 2026-02-10 US claimed
WO-2025223971-A1 AMPHIPHILIC POLYACETAL BLOCK COPOLYMERS, THEIR PRODUCTION, AND THEIR USE IN AGROCHEMICAL PRODUCTS AND AGROCHEMICAL FORMULATIONS BASF SE (DE) 2025-10-30 WO claimed
US-20250075109-A1 SNAP-CURE FLEXIBLE ELECTRICALLY CONDUCTIVE ONE COMPONENT (1K) EPOXY ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-03-06 US claimed
CN-119317680-A Fast curing flexible conductive one-part (1K) epoxy adhesive compositions 汉高股份有限及两合公司 2025-01-14 CN claimed
WO-2023232399-A1 SNAP-CURE FLEXIBLE ELECTRICALLY CONDUCTIVE ONE COMPONENT (1K) EPOXY ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2023-12-07 WO claimed
EP-4286488-A1 SNAP-CURE FLEXIBLE ELECTRICALLY CONDUCTIVE ONE-COMPONENT (1K) EPOXY ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2023-12-06 EP claimed
EP-2371782-B1 Cartridge or foil pouch containing a chemical two-component mortar composition with improved adhesion to the surface of semi-purified and/or wet bore holes in mineral base and use of same HILTI AG (LI) 2021-06-23 EP claimed
CN-107710077-B Recording material and image forming method 佳能株式会社 2021-03-30 CN claimed
EP-3306401-B1 RECORDED MATTER AND IMAGE FORMING METHOD CANON KK (JP) 2020-11-11 EP claimed
WO-2006098676-A1 ULTRAVIOLET CURING RESIN COMPOSITION PERSTORP SPECIALTY CHEMICALS AB (SE) 2006-09-21 WO claimed
CN-1812878-A Thermoplastic powder material system for cosmetic molds from three-dimensional printing systems Z CORP (US) 2006-08-02 CN claimed
US-6617417-B1 Containing divinyl ether curing agents; suitable for gelcoats, lamination resins and applications where thicker layers of the product are required. ASHLAND, INC. 2003-09-09 US claimed
US-6548566-B1 Curable resin comprising polyol, epoxy compound, and photoinitiator HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2003-04-15 US claimed
WO-2002096180-A1 A RADIATION CURABLE PRIMARY COATING COMPOSITION FOR AN OPTICAL FIBER ALVIN C. LEVY & ASSOCIATES, INC. (US) 2002-12-05 WO claimed
EP-1151040-A1 UNSATURATED POLYESTER RESIN COMPOSITIONS Ashland Inc. (US) 2001-11-07 EP claimed
WO-2000046297-A1 UNSATURATED POLYESTER RESIN COMPOSITIONS ASHLAND INC. (US) 2000-08-10 WO claimed
US-6042943-A PROTECTIVE COATING FOR RELIEVING STRESS WHEN FIBER IS BENT, CABLED, AND SPOOLED ALVIN C. LEVY & ASSOCIATES, INC. (US) 2000-03-28 US claimed
US-5985952-A CURABLE COATINGS FOR OPTICAL FIBERS WITH EPOXIDE GROUPS AND ACRYLATE MONOMERS ALVIN C. LEVY & ASSOCIATES, INC. (US) 1999-11-16 US claimed
US-5814678-A CONTROLLING REACTION KINETICS BY INCREASING OR DECREASING PRESSURE IN CLOSED SYSTEM UNIVERSITY TECHNOLOGY CORP. (US) 1998-09-29 US claimed