⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3691608 | 0.88 | — | — | |
| SCHEMBL3698471 | 0.83 | — | — | |
| SCHEMBL20573058 | 0.80 | — | — | |
| SCHEMBL20572578 | 0.80 | — | — | |
| SCHEMBL4525879 | 0.77 | — | — | |
| SCHEMBL3693623 | 0.73 | — | — | |
| SCHEMBL3687057 | 0.73 | — | — | |
| SCHEMBL7740497 | 0.71 | — | — | |
| SCHEMBL15612666 | 0.70 | — | — | |
| SCHEMBL20572577 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024135780-A1 | POLYIMIDE FILM, MULTILAYER BODY, FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2024-06-27 | — | — | WO | disclosed |
| CN-116964131-A | Polyamic acid, polyimide, and use thereof | 东洋纺株式会社 | 2023-10-27 | — | — | CN | disclosed |
| WO-2023013453-A1 | ELECTRONIC DISPLAY APPARATUS | 東洋紡株式会社 | 2023-02-09 | — | — | WO | disclosed |
| US-11548984-B2 | Light- or heat-curing method and curable resin composition | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2023-01-10 | — | — | US | disclosed |
| WO-2023276880-A1 | POLYAMIC ACID, POLYIMIDE, AND USE THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276864-A1 | SILSESQUIOXANE COMPOUND AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276887-A1 | POLY(AMIC ACID), POLYIMIDE, AND USES THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-115202149-A | Negative radiation-sensitive resin composition, insulating film for organic electroluminescent element, method for forming the same, and organic electroluminescent device | JSR株式会社 | 2022-10-18 | — | — | CN | disclosed |
| CN-110678500-B | Photo-or thermosetting method and curable resin composition | 富士胶片和光纯药株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-108602955-B | Photocuring method, compound used in photocuring method, and composition | 富士胶片和光纯药株式会社 | 2021-08-06 | — | — | CN | disclosed |
| EP-3409709-B1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM WAKO PURE CHEMICAL CORP (JP) | 2020-08-19 | — | — | EP | disclosed |
| US-20200123324-A1 | LIGHT- OR HEAT-CURING METHOD AND CURABLE RESIN COMPOSITION | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2020-04-23 | — | — | US | disclosed |
| CN-110678500-A | Photo-or thermosetting method and curable resin composition | 富士胶片和光纯药株式会社 | 2020-01-10 | — | — | CN | disclosed |
| US-20190055210-A1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2019-02-21 | — | — | US | disclosed |
| EP-3409709-A1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM Wako Pure Chemical Corporation (JP) | 2018-12-05 | — | — | EP | disclosed |
| US-8841050-B2 | Photosensitive resin composition and applications thereof | CHI MEI CORPORATION (TW) | 2014-09-23 | — | — | US | disclosed |
| US-20140087308-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF | CHI MEI CORPORATION (TW) | 2014-03-27 | — | — | US | disclosed |
| US-8318885-B2 | Curable resin composition, cured product thereof, and various articles derived from those | ARAKAWA CHEMICAL INDUSTRIES LTD. (JP) | 2012-11-27 | — | — | US | disclosed |
| US-20100215937-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS ARTICLES DERIVED FROM THOSE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2010-08-26 | — | — | US | disclosed |
| US-20090286015-A1 | Curable resin composition, cured product thereof, and various articles derived from those | AKAKAWA CHEMICAL INDUSTRIES, LTD (JP) | 2009-11-19 | — | — | US | disclosed |