SCHEMBL3699752

SCHEMBL3699752

CC(C)O[Al+]OC(C)C.CCCCCCCCC=CCCCCCCCCCC(=O)CC(=O)[O-]

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
FABP3 P05413 7/20 0.55
FAAH O00519 8/20 0.49
GMNN O75496 1/20 0.45
USP2 O75604 1/20 0.45
LMNA P02545 1/20 0.45
CYP1A2 P05177 1/20 0.45
POLB P06746 1/20 0.45
MAPT P10636 1/20 0.45
CYP2C9 P11712 1/20 0.45
ALOX15 P16050 1/20 0.45
APEX1 P27695 1/20 0.45
CYP2C19 P33261 1/20 0.45
RECQL P46063 1/20 0.45
BLM P54132 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
HSD17B10 Q99714 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3702503 0.92 HAO1 (0.53) FABP3FAAHLMNAMAPT
SCHEMBL3707034 0.92 HAO1 (0.53) FABP3FAAHLMNAMAPT
SCHEMBL17106144 0.92 HAO1 (0.53) FABP3FAAHLMNAMAPT
SCHEMBL7112635 0.90 HAO1 (0.50) FABP3FAAHLMNAMAPT
SCHEMBL28697999 0.90 FABP3 (0.48) FABP3FAAH
SCHEMBL7559215 0.89 FABP3 (0.71) FABP3FAAHGMNNUSP2LMNA
SCHEMBL7559223 0.89 FABP3 (0.71) FABP3FAAHGMNNUSP2LMNA
SCHEMBL21050014 0.88 FABP3 (0.59) FABP3FAAHGMNNUSP2LMNA
SCHEMBL29113332 0.86 FABP3 (0.58) FABP3FAAHGMNNUSP2LMNA
SCHEMBL7109933 0.86 HAO1 (0.43) FAAHLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024204044-A1 THERMOSETTING ADHESIVE SHEET, LAMINATE, AND METHOD FOR PRODUCING LAMINATE リンテック株式会社 2024-10-03 WO disclosed
WO-2024181810-A1 ADHESIVE COMPOSITION AND ADHESIVE SHEET FORMED THEREFROM 동우화인켐 주식회사 2024-09-06 WO disclosed
EP-3127972-B1 ADHESIVE SHEET LINTEC CORP (JP) 2023-08-02 EP disclosed
WO-2023095601-A1 LATENT CURING AGENT AND METHOD FOR PRODUCING SAME, AND CURABLE COMPOSITION デクセリアルズ株式会社 2023-06-01 WO disclosed
US-11646439-B2 Battery and method of manufacturing battery LINTEC CORPORATION (JP) 2023-05-09 US disclosed
CN-115996830-A Flexible tube for endoscope, endoscopic medical device, and method for producing same 富士胶片株式会社 2023-04-21 CN disclosed
EP-3594310-B1 LIQUID-REPELLENT COMPOSITION, LIQUID-REPELLENT SHEET, AND METHODS FOR PRODUCING SAME LINTEC CORP (JP) 2023-02-22 EP disclosed
US-20210298565-A1 FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPIC MEDICAL DEVICE, AND METHODS FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210005919-A1 BATTERY AND METHOD OF MANUFACTURING BATTERY LINTEC CORP (JP) 2021-01-07 US disclosed
US-20200392377-A1 LIQUID-REPELLENT COMPOSITION, LIQUID-REPELLENT SHEET, AND METHODS FOR PRODUCING SAME LINTEC CORPORATION (JP) 2020-12-17 US disclosed
EP-3323865-A1 ANTIFOULING COMPOSITION, ANTIFOULING SHEET, AND PROCESS FOR PRODUCING ANTIFOULING SHEET Lintec Corporation (JP) 2018-05-23 EP disclosed
US-9862167-B2 Laminate including antireflective moth-eye film and protection film SHARP KABUSHIKI KAISHA (JP) 2018-01-09 US disclosed
US-20170183544-A1 ADHESIVE SHEET LINTEC CORPORATION (JP) 2017-06-29 US disclosed
EP-3127972-A1 ADHESIVE SHEET LINTEC Corporation (JP) 2017-02-08 EP disclosed
EP-3127980-A1 ADHESIVE SHEET LINTEC Corporation (JP) 2017-02-08 EP disclosed
EP-2821817-A1 LAMINATE Sharp Kabushiki Kaisha (JP) 2015-01-07 EP disclosed
US-20140342121-A1 LAMINATE LINTEC CORPORATION (JP) 2014-11-20 US disclosed
US-20130029137-A1 Adhesive Sheet LINTEC CORPORATION (JP) 2013-01-31 US disclosed
US-20120148837-A1 ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR INSPECTING STAMPERS LINTEC CORPORATION (JP) 2012-06-14 US disclosed
EP-2452992-A1 ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR INSPECTING STAMPERS LINTEC Corporation (JP) 2012-05-16 EP disclosed