SCHEMBL372526

SCHEMBL372526

[Co].[Mo].[P]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5484757 0.87
SCHEMBL31362152 0.87
SCHEMBL59561 0.82
SCHEMBL336140 0.82
SCHEMBL862074 0.82
SCHEMBL28315322 0.82
SCHEMBL11503491 0.82
SCHEMBL5387590 0.67
SCHEMBL8640869 0.67
SCHEMBL7052652 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118888710-A Black phosphorus-based negative electrode material, preparation method thereof, negative electrode plate and battery 安徽得壹能源科技有限公司 2024-11-01 CN claimed
WO-2024156770-A1 PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER Atotech Deutschland GmbH & Co. KG (DE) 2024-08-02 WO claimed
EP-4407067-A1 PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER Atotech Deutschland GmbH & Co. KG (DE) 2024-07-31 EP claimed
CN-112090435-B Cobalt-molybdenum-based sulfur-tolerant shift catalyst and preparation method and application thereof 国家能源投资集团有限责任公司 2023-01-03 CN claimed
CN-114525534-A Active electrolytic water electrode and preparation method and application thereof 中国科学院大连化学物理研究所 2022-05-24 CN claimed
CN-112090435-A Cobalt-molybdenum-based sulfur-tolerant shift catalyst and preparation method and application thereof 国家能源投资集团有限责任公司 2020-12-18 CN claimed
US-20200232099-A1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD AND A METHOD FOR DEPOSITING A GOLD LAYER ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2020-07-23 US claimed
CN-105702630-B Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2020-07-10 CN claimed
CN-107311132-B A method of synthesizing ultra-fine ternary cobalt molybdenum phosphorus nanometer rods 吉林大学 2019-08-02 CN claimed
CN-108026642-A Plating bath composition for electroless gold plating and method for depositing gold layer 埃托特克德国有限公司 2018-05-11 CN claimed
US-8502381-B2 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers LAM RESEARCH CORPORATION (US) 2013-08-06 US claimed
CN-102800621-A Method for forming embolism structure and semiconductor device SEMICONDUCTOR MFG INT SHANGHAI 2012-11-28 CN claimed
CN-102790008-A Method for forming contact plug SEMICONDUCTOR MFG INT SHANGHAI 2012-11-21 CN claimed
CN-102344338-A Process for upgrading heavy benzene hydrogenation XINGTAI RISUN COAL CHEMICAL INDUSTRY CO LTD 2012-02-08 CN claimed
US-20070134431-A1 Electroless plating apparatus and electroless plating method TOKYO ELECTRON LIMITED 2007-06-14 US claimed
US-20050230262-A1 Electrochemical methods for the formation of protective features on metallized features SEMITOOL, INC. 2005-10-20 US claimed
CN-1660695-A Method for preparing phosphide of transition metal DALIAN INST CHEM & PHYSICS CAS (CN) 2005-08-31 CN claimed
US-6528184-B2 Jewelry; prevention migration of copper HONG KONG POLYTECHNIC UNIVERSITY (HK) 2003-03-04 US claimed
US-20020155315-A1 Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings HONG KONG POLYTECHNIC UNIVERSITY, THE (HK) 2002-10-24 US claimed
US-4724226-A HIGH SURFACE AREA; DEMETALLIZATION W. R. GRACE & CO. (US) 1988-02-09 US claimed