⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL577017 | 0.95 | — | — | |
| Water SCHEMBL4274854 | 0.92 | — | — | |
| SCHEMBL10992453 | 0.91 | — | — | |
| Ammonia Solution, Strong SCHEMBL10442409 | 0.91 | — | — | |
| SCHEMBL3727540 | 0.91 | — | — | |
| SCHEMBL7127238 | 0.91 | — | — | |
| SCHEMBL3726014 | 0.91 | — | — | |
| SCHEMBL3726360 | 0.91 | — | — | |
| SCHEMBL10986202 | 0.91 | — | — | |
| Ethylene Glycol SCHEMBL6419466 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114717615-A | Improved photoresist resolution by anisotropic copper plating | 罗门哈斯电子材料有限责任公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-111996564-B | Copper electroplating solution for high-aspect-ratio printed circuit board and metallization method | 广东硕成科技股份有限公司 | 2022-05-17 | — | — | CN | disclosed |
| CN-112680758-A | Method for enhanced copper electroplating | 罗门哈斯电子材料有限责任公司 | 2021-04-20 | — | — | CN | disclosed |
| CN-111996564-A | Copper electroplating solution for high-aspect-ratio printed circuit board and metallization method | 广东硕成科技有限公司 | 2020-11-27 | — | — | CN | disclosed |
| CN-110300573-A | Purposes of the bio-based polymers in makeup, dermatology or pharmacological compositions | 科莱恩国际有限公司 | 2019-10-01 | — | — | CN | disclosed |
| EP-1975613-B1 | Kits and methods for evaluating hair damage | OREAL (FR) | 2012-07-18 | — | — | EP | disclosed |
| US-7749763-B2 | Kits and methods for evaluating hair | L'OREAL S.A. (FR) | 2010-07-06 | — | — | US | disclosed |
| US-20080241854-A1 | KITS AND METHODS FOR EVALUATING HAIR | L'OREAL S.A. (FR) | 2008-10-02 | — | — | US | disclosed |
| EP-1975613-A1 | Kits and methods for evaluating hair | L'OREAL (FR) | 2008-10-01 | — | — | EP | disclosed |
| US-20080085249-A1 | Artificial hair color removal compositions and methods | L'OREAL (FR) | 2008-04-10 | — | — | US | disclosed |
| US-5993794-A | CONTAINING 2-7% OF THIOGLYCOLIC ACID, SALT OF THIOGLYCOLIC ACID, CYSTEINE AND/OR ACETYL CYSTEINE AND 1.5-17.5% OF DITHIODIGLYCOLIC ACID, ACID AND/OR CYSTINE | TAKARA BELMONT KABUSHIKI KAISHA (JP) | 1999-11-30 | — | — | US | disclosed |