Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.44 |
| ▸ | THRB | P10828 | 1/20 | 0.44 |
| ▸ | DNM1 | Q05193 | 7/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL613294 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL2367729 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL3173904 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL19385575 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL8355145 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL441896 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL7789575 | 1.00 | — | — | |
| SCHEMBL17991922 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL20636855 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL28027338 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118762871-B | Fireproof short-circuit-proof anti-aging wire and cable | 浙江欧普线缆有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-118762871-A | Fireproof short-circuit-proof anti-aging wire and cable | 浙江欧普线缆有限公司 | 2024-10-11 | — | — | CN | claimed |
| CN-118046635-A | Novel composite waterproof material and preparation method thereof | 东营市沃格艾迪石油技术有限公司 | 2024-05-17 | — | — | CN | claimed |
| CN-116277323-A | Preparation method of high-moisture-proof bamboo shaving board | 点金新型材料研究院(厦门)有限公司 | 2023-06-23 | — | — | CN | claimed |
| CN-109129780-A | A kind of preparation method of paraffin/silane waterproofing agent | 太仓欧典新材料有限公司 | 2019-01-04 | — | — | CN | claimed |
| CN-118762871-B | Fireproof short-circuit-proof anti-aging wire and cable | 浙江欧普线缆有限公司 | 2025-03-28 | — | — | CN | disclosed |
| CN-119425407-A | Super-hydrophobic polymeric membrane and preparation method and application thereof | 江苏扬农化工集团有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-119263677-A | Self-dispersion nano silicon dioxide particles for cement-based material and preparation method thereof | 河南理工大学 | 2025-01-07 | — | — | CN | disclosed |
| CN-118762871-A | Fireproof short-circuit-proof anti-aging wire and cable | 浙江欧普线缆有限公司 | 2024-10-11 | — | — | CN | disclosed |
| WO-2024190566-A1 | SEALING FILM AND PRODUCTION METHOD FOR SAME AND ELECTRONIC COMPONENT DEVICE AND PRODUCTION METHOD FOR SAME | 株式会社レゾナック | 2024-09-19 | — | — | WO | disclosed |
| CN-118415958-A | Preparation and application of AS-PNS nanocrystalline-loaded soluble microneedle for scar repair | 西南大学 | 2024-08-02 | — | — | CN | disclosed |
| CN-112071998-B | Light-emitting device and display device | 京东方科技集团股份有限公司 | 2024-06-11 | — | — | CN | disclosed |
| US-20160216608-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING RESIST PATTERN | HITACHI CHEMICAL COMPANY, LTD (JP) | 2016-07-28 | — | — | US | disclosed |
| US-9235121-B2 | Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-01-12 | — | — | US | disclosed |
| US-20140251676-A1 | STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-11 | — | — | US | disclosed |
| US-20140154628-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PERMANENT RESIST AND METHOD FOR PRODUCING PERMANENT RESIST | RESONAC CORPORATION (JP) | 2014-06-05 | — | — | US | disclosed |
| CN-101471414-B | Process for producing light-emitting semiconductor device | TOSHIBA CORP | 2010-12-08 | — | — | CN | disclosed |
| US-7838311-B2 | Process for producing light-emitting semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 2010-11-23 | — | — | US | disclosed |
| US-20090176323-A1 | PROCESS FOR PRODUCING LIGHT-EMITTING SEMICONDUCTOR DEVICE | KABUSHIKI KAISHA TOSHIBA (JP) | 2009-07-09 | — | — | US | disclosed |
| CN-101471414-A | Process for producing light-emitting semiconductor device | TOSHIBA KK (JP) | 2009-07-01 | — | — | CN | disclosed |