SCHEMBL3755387

SCHEMBL3755387

O=S(=O)(O)CC(S(=O)(=O)O)S(=O)(=O)OC(F)(F)F

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8875441 0.72 SLC22A6 (0.50) SLC22A6
SCHEMBL26112079 0.63 SLC22A6 (0.36) SLC22A6
SCHEMBL324326 0.62
SCHEMBL776805 0.61 SLC22A6 (0.39) SLC22A6
SCHEMBL27638410 0.61
Fluoride SCHEMBL22999160 0.60 TSHR (0.41)
Hydrochloric Acid SCHEMBL28835282 0.60 TSHR (0.41)
SCHEMBL3647314 0.60 SLC22A6 (0.42) SLC22A6
Ammonia Solution, Strong SCHEMBL27865117 0.60 TSHR (0.41)
SCHEMBL27758849 0.60 TSHR (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9034557-B2 Chemically amplified positive photoresist composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2015-05-19 US disclosed
US-20100304299-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2010-12-02 US disclosed