Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL9044735 | 0.71 | HDAC8 (0.35) | HSP90AA1 | |
| SCHEMBL10912427 | 0.69 | HSP90AA1 (0.38) | HSP90AA1 | |
| SCHEMBL13075220 | 0.61 | HSP90AA1 (0.42) | HSP90AA1 | |
| SCHEMBL373166 | 0.60 | HSP90AA1 (0.50) | HSP90AA1 | |
| Hydrogen Sulfide SCHEMBL6754829 | 0.57 | — | — | |
| SCHEMBL31008582 | 0.56 | HSP90AA1 (0.38) | HSP90AA1 | |
| SCHEMBL2320499 | 0.56 | — | — | |
| SCHEMBL13911007 | 0.56 | HSP90AA1 (0.44) | HSP90AA1 | |
| SCHEMBL28083757 | 0.56 | — | — | |
| SCHEMBL185513 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102666919-A | Electroless gold plating solution and electroless gold plating method | ELECTROPLATING ENG | 2012-09-12 | — | — | CN | claimed |
| CN-104281005-B | Hardening resin composition, its solidfied material, with its printed circuit board and solidfied material manufacturing method | 太阳油墨制造株式会社 | 2019-11-08 | — | — | CN | disclosed |
| CN-110320747-A | CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD | 太阳油墨制造株式会社 | 2019-10-11 | — | — | CN | disclosed |
| CN-109563222-A | Photocurable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2019-04-02 | — | — | CN | disclosed |
| CN-109073969-A | Hardening resin composition, dry film, solidfied material and printed circuit board | 太阳油墨制造株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-108885400-A | Hardening resin composition, dry film, solidfied material and printed circuit board | 太阳油墨制造株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108459465-A | Photosensitive film, photosensitive film lamination body and the solidfied material formed using them | 太阳油墨制造株式会社 | 2018-08-28 | — | — | CN | disclosed |
| CN-108333876-A | Photosensitive film lamination body and the solidfied material formed using it | 太阳油墨制造株式会社 | 2018-07-27 | — | — | CN | disclosed |
| CN-108327357-A | Photosensitive film lamination body and the solidfied material formed using it | 太阳油墨制造株式会社 | 2018-07-27 | — | — | CN | disclosed |
| CN-103073540-B | V-shaped triazine core compound and application thereof | UNIV ZHEJIANG TECHNOLOGY | 2015-01-28 | — | — | CN | disclosed |
| CN-103073540-A | V-shaped triazine core compound and application thereof | UNIV ZHEJIANG TECHNOLOGY | 2013-05-01 | — | — | CN | disclosed |
| CN-102666919-A | Electroless gold plating solution and electroless gold plating method | ELECTROPLATING ENG | 2012-09-12 | — | — | CN | disclosed |
| US-20100292469-A1 | PROCESS FOR THE PREPARATION OF N-TRIAZINYLAMMONIUM SALTS | ITALVELLUTI S.P.A. (IT) | 2010-11-18 | — | — | US | disclosed |
| EP-1951691-A1 | PROCESS FOR THE PREPARATION OF N-TRIAZINYLAMMONIUM SALTS | Italvelluti S.p.A. (IT) | 2008-08-06 | — | — | EP | disclosed |
| WO-2007051496-A1 | PROCESS FOR THE PREPARATION OF N-TRIAZINYLAMMONIUM SALTS | ITALVELLUTI S.P.A. (IT) | 2007-05-10 | — | — | WO | disclosed |