SCHEMBL3766795

SCHEMBL3766795

O=C(O)c1ccc(C(=O)O)c(C(=O)Oc2ccccc2)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.59
HSD17B10 Q99714 2/20 0.51
HPGD P15428 2/20 0.51
ALOX15 P16050 1/20 0.51
CDC25A P30304 1/20 0.51
CDC25B P30305 1/20 0.51
MAPT P10636 5/20 0.51
LMNA P02545 2/20 0.51
TP53 P04637 1/20 0.51
CYP3A4 P08684 1/20 0.51
ADORA3 P0DMS8 1/20 0.51
CHRM1 P11229 1/20 0.51
TBXA2R P21731 1/20 0.51
SLC6A2 P23975 1/20 0.51
PDE4A P27815 1/20 0.51
ADRA1A P35348 1/20 0.51
KDR P35968 1/20 0.51
SLC6A3 Q01959 1/20 0.51
SMN1; SMN2 Q16637 1/20 0.51
HDAC6 Q9UBN7 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30545240 0.93 KDM4E (0.54) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL10921841 0.93 KDM4E (0.54) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL11848524 0.93 KDM4E (0.53) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL9987911 0.90 MAPT (0.49) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL11370233 0.88 HSD17B10 (0.58) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL11733242 0.86 MAPT (0.54) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL9122753 0.86 KDM4E (0.49) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL29399849 0.86 KDM4E (0.49) KDM4EHSD17B10HPGDALOX15CDC25A
SCHEMBL347341 0.86 MAPT (0.57) KDM4EHSD17B10HPGDALOX15MAPT
SCHEMBL11805187 0.84 HSD17B10 (0.53) KDM4EHSD17B10HPGDALOX15CDC25A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116333411-B Flame-retardant EVA (ethylene vinyl acetate) heat-insulating material and preparation method thereof 石家庄启宏新材料制品有限公司 2023-08-11 CN claimed
CN-116333411-A Flame-retardant EVA (ethylene vinyl acetate) heat-insulating material and preparation method thereof 石家庄启宏新材料制品有限公司 2023-06-27 CN claimed
US-6121452-A REACTING A NITROGEN-CONTAINING HETEROCYCLIC COMPOUND WITH AN AROMATIC DICARBOXYLIC ACID OR AN ANHYDRIDE THEREOF IN AN ORGANIC SOLVENT IN THE PRESENCE OF AN UNSUBSTITUTED PHENOL OR NAPHTHOL OR MIXTURE THEREOF BAYER AKTIENGESELLSCHAFT (DE) 2000-09-19 US claimed
US-5037862-A Excellent mechanical stability in printing HITACHI CHEMICAL COMPANY, LTD. (JP) 1991-08-06 US claimed
EP-0140341-A1 Preparation of branched polycarbonates by transesterification with a triaryl tricarboxylic acid branching agent GENERAL ELECTRIC COMPANY (US) 1985-05-08 EP claimed
CN-116333411-B Flame-retardant EVA (ethylene vinyl acetate) heat-insulating material and preparation method thereof 石家庄启宏新材料制品有限公司 2023-08-11 CN disclosed
CN-116333411-A Flame-retardant EVA (ethylene vinyl acetate) heat-insulating material and preparation method thereof 石家庄启宏新材料制品有限公司 2023-06-27 CN disclosed
EP-1480235-B1 FLEXIBLE MAGNET AND METHOD FOR MANUFACTURING MOTOR USING THE SAME PANASONIC CORP (JP) 2014-12-31 EP disclosed
US-7843045-B2 Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device HITACHI CHEMICAL CO., LTD. (JP) 2010-11-30 US disclosed
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
US-20090091012-A1 THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, LEAD FRAME, AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-04-09 US disclosed
US-7381280-B2 Manufacturing methods of flexible bonded magnet and motor using the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2008-06-03 US disclosed
EP-0603731-A1 Purification of liquid crystals and liquid crystal composition HITACHI CHEMICAL COMPANY, LTD. (JP) 1994-06-29 EP disclosed
US-5212279-A Hot-melt adhesive and its use in polyimide film and printed circuit board HITACHI CHEMICAL CO., LTD. (JP) 1993-05-18 US disclosed
US-5037862-A Excellent mechanical stability in printing HITACHI CHEMICAL COMPANY, LTD. (JP) 1991-08-06 US disclosed
US-4791157-A REACTING TRIMELLITIC ACID WITH AROMATIC DIAMINE WITH ETHER GROUPS HITACHI CHEMICAL CO. (JP) 1988-12-13 US disclosed
US-4508779-A POLYESTERIMIDE COATINGS SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 1985-04-02 US disclosed
EP-0017422-B1 THERMOPLASTIC POLYAMIDEIMIDE COPOLYMERS AND METHOD OF PREPARATION TORAY INDUSTRIES, INC. (JP) 1983-11-30 EP disclosed
US-4299945-A HEAT POLYMERIZATION OF AN AROMATIC DIAMINO COMPOUND AND AN AROMATIC TRIBASIC CARBOXYLIC ACID TORAY INDUSTRIES, INC. (JP) 1981-11-10 US disclosed
EP-0017422-A1 Thermoplastic polyamideimide copolymers and method of preparation TORAY INDUSTRIES, INC. (JP) 1980-10-15 EP disclosed