Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SCN5A | Q14524 | 3/20 | 0.46 |
| ▸ | SCN9A | Q15858 | 3/20 | 0.46 |
| ▸ | FDPS | P14324 | 9/20 | 0.45 |
| ▸ | GGPS1 | O95749 | 5/20 | 0.45 |
| ▸ | CES2 | O00748 | 1/20 | 0.44 |
| ▸ | SMPD1 | P17405 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29187512 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL28343048 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL29416307 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL5664929 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL9400734 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL20472612 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL376656 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL30701054 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL29271580 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 | |
| SCHEMBL27438742 | 0.98 | SCN5A (0.47) | SCN5ASCN9AFDPSGGPS1CES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-11302460-A | — | — | None | — | — | JP | disclosed |
| US-12330244-B2 | Flux, solder paste, and method for producing bonded body | SENJU METAL INDUSTRY CO., LTD. (JP) | 2025-06-17 | — | — | US | disclosed |
| EP-4563279-A1 | FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY | Senju Metal Industry Co., Ltd. (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-20250170679-A1 | FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY | SENJU METAL INDUSTRY CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| CN-116555938-A | PLA fiber and nonwoven made therefrom | 道达尔能源科碧恩私人有限公司 | 2023-08-08 | — | — | CN | disclosed |
| CN-115815880-A | Solder composition and method for manufacturing flexible circuit board | 株式会社田村制作所 | 2023-03-21 | — | — | CN | disclosed |
| EP-2617567-B1 | PROPYLENE RESIN MULTI-LAYER SHEET, AND PACKAGING BODY FOR HEAT TREATMENT USING SAME | JAPAN POLYPROPYLENE CORP (JP) | 2019-10-30 | — | — | EP | disclosed |
| US-10155916-B2 | Lubricant for gas insulated switchgear, and gas insulated switchgear | HITACHI, LTD. (JP) | 2018-12-18 | — | — | US | disclosed |
| US-20170349854-A1 | LUBRICANT FOR GAS INSULATED SWITCHGEAR, AND GAS INSULATED SWITCHGEAR | HITACHI, LTD. (JP) | 2017-12-07 | — | — | US | disclosed |
| EP-2409836-B1 | MULTILAYER PROPYLENE RESIN SHEET AND PACKAGING MATERIAL FOR HEATING TREATMENT COMPRISING SAME | JAPAN POLYPROPYLENE CORP (JP) | 2016-05-04 | — | — | EP | disclosed |
| EP-2617765-B1 | PROPYLENE RESIN SHEET AND HEAT PROCESSING PACKAGING BODY USING SAME | JAPAN POLYPROPYLENE CORP (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-8877310-B2 | Propylene resin multi-layer sheet, and packaging body for heat treatment using same | JAPAN POLYPROPYLENE CORPORATION (JP) | 2014-11-04 | — | — | US | disclosed |
| US-8859062-B2 | Multilayer propylene resin sheet and heat-treatable packaging material using same | JAPAN POLYPROPYLENE CORPORATION (JP) | 2014-10-14 | — | — | US | disclosed |
| EP-2617567-A1 | PROPYLENE RESIN MULTI-LAYER SHEET, AND PACKAGING BODY FOR HEAT TREATMENT USING SAME | Japan Polypropylene Corporation (JP) | 2013-07-24 | — | — | EP | disclosed |
| EP-2617765-A1 | PROPYLENE RESIN SHEET AND HEAT PROCESSING PACKAGING BODY USING SAME | Japan Polypropylene Corporation (JP) | 2013-07-24 | — | — | EP | disclosed |
| US-20130177721-A1 | PROPYLENE RESIN SHEET AND HEAT PROCESSING PACKAGING BODY USING SAME | JAPAN POLYPROPYLENE CORPORATION (JP) | 2013-07-11 | — | — | US | disclosed |
| US-20130171389-A1 | PROPYLENE RESIN MULTI-LAYER SHEET, AND PACKAGING BODY FOR HEAT TREATMENT USING SAME | JAPAN POLYPROPYLENE CORPORATION (JP) | 2013-07-04 | — | — | US | disclosed |
| EP-2409836-A1 | MULTILAYER PROPYLENE RESIN SHEET AND PACKAGING MATERIAL FOR HEATING TREATMENT COMPRISING SAME | Japan Polypropylene Corporation (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-20110311742-A1 | MULTILAYER PROPYLENE RESIN SHEET AND HEAT-TREATABLE PACKAGING MATERIAL USING SAME | JAPAN POLYPROPYLENE CORPORATION (JP) | 2011-12-22 | — | — | US | disclosed |