⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL975706 | 0.82 | — | — | |
| SCHEMBL8904333 | 0.82 | — | — | |
| SCHEMBL8781675 | 0.82 | — | — | |
| SCHEMBL33372522 | 0.82 | — | — | |
| SCHEMBL1538485 | 0.82 | — | — | |
| SCHEMBL442058 | 0.82 | — | — | |
| SCHEMBL743245 | 0.82 | — | — | |
| SCHEMBL3778453 | 0.67 | — | — | |
| SCHEMBL3778824 | 0.67 | — | — | |
| SCHEMBL3765329 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220250039-A1 | VAPOR PHASE METHANOL CARBONYLATION CATALYST | ENERKEM INC. (CA) | 2022-08-11 | — | — | US | claimed |
| CN-114096347-A | Gas phase methanol carbonylation catalyst | 埃讷肯公司 | 2022-02-25 | — | — | CN | claimed |
| US-12383888-B2 | Vapor phase methanol carbonylation catalyst | ENERKEM INC. (CA) | 2025-08-12 | — | — | US | disclosed |
| US-20220250039-A1 | VAPOR PHASE METHANOL CARBONYLATION CATALYST | ENERKEM INC. (CA) | 2022-08-11 | — | — | US | disclosed |
| CN-114096347-A | Gas phase methanol carbonylation catalyst | 埃讷肯公司 | 2022-02-25 | — | — | CN | disclosed |
| WO-2020237350-A1 | VAPOR PHASE METHANOL CARBONYLATION CATALYST | ENERKEM INC. (CA) | 2020-12-03 | — | — | WO | disclosed |
| US-7855021-B2 | atomic layer deposition; platinum alloys; fuel cells | BROOKHAVEN SCIENCE ASSOCIATES, LLC (US) | 2010-12-21 | — | — | US | disclosed |
| US-7279231-B2 | Electroless plating structure | INTEL CORPORATION (US) | 2007-10-09 | — | — | US | disclosed |
| US-20070031722-A1 | Electrocatalysts having platinum monolayers on palladium, palladium alloy, and gold alloy nanoparticle cores, and uses thereof | UNITED STATES DEPARTMENT OF ENERGY | 2007-02-08 | — | — | US | disclosed |
| US-6908504-B2 | Electroless plating bath composition and method of using | INTEL CORPORATION (US) | 2005-06-21 | — | — | US | disclosed |
| US-20040038073-A1 | Electroless plating bath composition and method of using | CHEBIAM RAMANAN V (US) | 2004-02-26 | — | — | US | disclosed |
| US-20040035316-A1 | Electroless plating bath composition and method of using | CHEBIAM RAMANAN V (US) | 2004-02-26 | — | — | US | disclosed |
| US-6645567-B2 | Cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect | INTEL CORPORATION | 2003-11-11 | — | — | US | disclosed |
| US-20030113576-A1 | Electroless plating bath composition and method of using | INTEL CORPORATION | 2003-06-19 | — | — | US | disclosed |