SCHEMBL37810

SCHEMBL37810

O[SiH2][SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL894641 0.72
SCHEMBL1141165 0.67
SCHEMBL1141418 0.62
SCHEMBL1286547 0.61
SCHEMBL10860826 0.55
SCHEMBL9172189 0.55
SCHEMBL23749599 0.55
SCHEMBL8354132 0.55
SCHEMBL2828936 0.50
SCHEMBL11554337 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2539 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250376758-A1 SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL ASM IP HOLDING BV (NL) 2025-12-11 US claimed
US-20250135670-A1 SURFACE-TREATED CUTTING BLADES DEMONSTRATING EXTENDED BLADE EDGE RETENTION AND DECREASED FRICTION, AND METHODS OF REDUCING DEPOSITION OF A CONTAMINANT ON A SURFACE OF A METAL CUTTING BLADE ACULON INC 2025-05-01 US claimed
CN-119529233-A Organosilicon modified double-network crosslinked epoxy resin and preparation method and application thereof 安徽善孚新材料科技股份有限公司 2025-02-28 CN claimed
CN-118146741-B Process for improving adhesive property of rubber steel wire 江苏国立化工科技有限公司 2024-09-06 CN claimed
CN-111554694-B Array substrate, manufacturing method thereof, display panel and display device 京东方科技集团股份有限公司 2024-07-12 CN claimed
CN-118146741-A Process for improving adhesive property of rubber steel wire 江苏国立化工科技有限公司 2024-06-07 CN claimed
CN-117820954-B Water-based acrylic polyurethane finish paint and preparation method thereof 山东中胜涂料有限公司 2024-05-28 CN claimed
CN-118073199-A Semiconductor device and method for manufacturing the same 台湾积体电路制造股份有限公司 2024-05-24 CN claimed
US-20240170295-A1 SEMICONDUCTOR STRUCTURE BONDING METHOD, BONDING EQUIPMENT, MEMORY, MEMORY SYSTEM YANGTZE MEMORY TECHNOLOGIES CO., LTD. (CN) 2024-05-23 US claimed
US-11991835-B2 Method for increasing adhesion strength between a metal and an organic material ATOTECH DEUTSCHLAND GMBH (DE) 2024-05-21 US claimed
WO-1980000816-A1 IMPROVED IMPACT RESISTANT LAMINATE GEN ELECTRIC (US) 1980-05-01 WO claimed
US-4198468-A Impact resistant laminate GENERAL ELECTRIC COMPANY (US) 1980-04-15 US claimed
US-4182787-A Optically transparent, radiographically opaque tubing GENERAL ELECTRIC COMPANY (US) 1980-01-08 US claimed
US-4126730-A Laminates GENERAL ELECTRIC COMPANY (US) 1978-11-21 US claimed
US-4123588-A Laminates GENERAL ELECTRIC COMPANY (US) 1978-10-31 US claimed
US-4122246-A Method of preventing discoloration of platinum containing silicone gels DOW CORNING CORPORATION (US) 1978-10-24 US claimed
US-4087585-A TWO-PACKAGE ADHESIVE, EPOXY SILOXANES DOW CORNING CORPORATION (US) 1978-05-02 US claimed
US-4051077-A Non-filming dual additive developer XEROX CORPORATION (US) 1977-09-27 US claimed
US-4027072-A Laminates GENERAL ELECTRIC COMPANY (US) 1977-05-31 US claimed
US-3996184-A CONSTRUCTION MATERIALS DOW CORNING CORPORATION (US) 1976-12-07 US claimed